Dow Dowsil 3-6635 Dielectric Gel

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Description for Dow Dowsil 3-6635 Dielectric Gel

Extremely soft to medium hardness, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wider temperature range than the other types of gels.

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Brand	Dowsil
Application Type	Encapsulants
1 Part or 2 Part	1-Part
Material Form	Gel
Industry	Optoelectronics, PCB system assemblies, Smart Meters, E-Mobility Solutions, Smart Home Devices
Manufacturer	Dow
Chemistry	Silicone
Cure Method	Heat
Cure Temperature (°C)	100, 125, 150, 100
Cure Time (min)	48, 7, 6, 120
Viscosity (cPs)	Low, 700
Color	Clear
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	4.8E+13 (ohms/cm)
Light Refractive Index (RI)	High

Best Practices for Dow Dowsil 3-6635 Dielectric Gel

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Technical Data for Dow Dowsil 3-6635 Dielectric Gel

*See Terms of Use Below

Overview

Application Type
- Pottant / Encapsulant - Encapsulants
1 Part or 2 Part
- 1-Part
Material Form
- Gel
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Optoelectronics
- Printed Circuit Board (PCB) - PCB system assemblies
Chemistry
- Silicone
Application Method
- Other - Manual or automated equipment
Cure Method
- Heat
Color
- Clear / Transparent - Clear
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	100, 125, 150, 100	Test Method
Cure Time (min)	48, 7, 6, 120	Test Method
Viscosity (cPs)	Low, 700
Set Time (min)	11	Test Method

Material Resistance

High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00020, <0.00010	Test Method
Dielectric Strength (V/mil)	525, Excellent
Dielectric Constant	2.83, 2.84	Test Method
Volume Resistivity (O)	4.8E+13 (ohms/cm)

Hardness

Shore A Hardness	75 g, Soft to Medium
Flexibility	Resilient, Flexible

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	1.000	Test Method
Flash Point (°F)	231.8

Business Information

Shelf Life Details	Storage conditions and shelf life (“Use By” date) are indicated on the product label.
Shelf Life Temperature (°F)	77
Shelf Life (mon)	6

Not Good For

Don't Use For	Other sulfur containing materials, Polysulfones, Polysulfides, Sulfur, Silicone rubber containing organotin catalyst, Organometallic compounds, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Some solder flux residues

Best Practices for Dow Dowsil 3-6635 Dielectric Gel

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1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
2. Deairing/Degassing
  
  If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
3. Curing
  
  Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). For one-part products the viscosity either increases at a much lower rate or does not change significantly at RT. Cure conditions are shown in the typical properties table. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
4. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.
Comparable Materials for Dow Dowsil 3-6635 Dielectric Gel

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Spec Engine^® Results
- Sylgard 537 One Part Dielectric Gel(Dow)
  Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.
- Dowsil EG-3810 Dielectric Gel(Dow)
  A One-Part; Heat-Cure; Very Soft; Excellent Thermally Stable Silicone Gel.
- KE-1062(Shinetsu)
  Shinetsu KE-1062 is a 1-Part Heat cure Phenyl-based polysiloxane Gel used to Pot and Encapsulate Ceramics, Glass and Metals
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