MicroCoat Technologies E53103 Datasheet MicroCoat Technologies E53103

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  • Description for MicroCoat Technologies E53103

    Two Part Epoxy. An excellent room temperature cure, thermally conductive potting and encapsulation compound.

    *See Terms of Use Below

    Application Type Encapsulation, Potting
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Manufacturer MicroCoat Technologies
    Chemistry Epoxy
    Cure Method 2-Part Cure, Room temperature cure
    Cure Temperature (°C) 20 to 25 RT
  • Technical Data for MicroCoat Technologies E53103

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Chemistry
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • 2-Part Cure
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 RT
    Set Time (min) >185 Test Method
    Work / Pot Time (min) >185 Test Method
    Mix Ratio 40:13.7
    Bond Strength
    General Bond Strength (psi) Excellent
    Material Resistance
    Vibration Resistance/Shock Resistance Shock resistance
    Conductivity
    Dielectric Strength (V/mil) High
    Thermal Conductivity (W/m°K) Thermally conductive
    Hardness
    Shore D Hardness 90
  • Best Practices

    Best Practices information currently not available.
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Gluespec Poll

Which answer best describes a project you are currently working on?
Set Time Test Methods
Set Time Test Method
>185 min Gel Time
Work / Pot Time Test Methods
Work / Pot Time Test Method
>185 min Pot Life