HBAB-9349K
Bond; 2-Part; Paste; Epoxy; 2-Part Cure;
A flexible, two part, room temperature curing system with high peel and sheer strengths. It is excellent for bonding many metals and woods, most plastics and rubbers and masonry products.;
BA-826H02
Bond; 2-Part; Liquid; Epoxy; Resin/hardener;
A thermally conductive epoxy system that features a small particle size, spherical filler. This filler makes it well suited to applications where extrusion through small-gauge needles is desired. It is ideal for die and heat sink attach, staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.;
Tra-Bond 2158
Bond; 2-Part; Liquid; Epoxy; Room temperature cure;
It is a two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve
heat transfer while maintaining electrical insulation.;
Loctite Ablestik 724-14C
Bond; 1-Part; Paste; Polyurethane; Heat;
Premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar and steel. Adhesive strength is maintained even in cryogenic conditions.;
Tra-Bond 2137
Bond; 2-Part; Liquid; epoxy; Resin/Hardener;
An easy-to-apply, room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its instant development of a no-sag characteristics is critical. ;
BB-2104
Bond; 2-Part; Liquid; Epoxy; Resin/hardener;
A thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.;
BA-F113
Bond; 2-Part; Liquid; Epoxy; 2-Part Cure;
• Low viscosity • Optically clear • Resistant to mechanical impact • Excellent wettability • Excellent thermal shock resistance • Optical components and LED displays • Room Temperature or Heat Cure;
BB-F114
Bond; 2-Part; Liquid; Epoxy; Heat;
A clear, low viscosity, room temperature cure, epoxy system with good optical properties that contains no solvents, has excellent wicking and wetting characteristics, and adheres strongly to glass, ceramics, most metals and plastics.;
Loctite Ablestik 813J01 BIPAX
Bond; 2-Part; Liquid; Silicone; Heat Cure;
• Silicone • Red • Room Temperature Cure • Heat Cure • Excellent thermal conductivity • Bonds well to difficult substrates • Low stress • Encapsulation • Transformers • Thermistors • Power supplies • Heat sinks;
Loctite Eccobond F 253
Bond; 2-Part; Liquid; Epoxy; Resin/hardener;
● Low stress ● Low viscosity ● Excellent wicking ● Good high temperature performance ● Resistant to mechanical impact ● Excellent thermal shock resistance ● Tough adhesion to a wide variety of fiber optic and optic materials ● Color keyed formulation that indicates cure status ● Fiber optic assembly and Other optic
applications;