Gluespec Articles
Adhesive Selection For Semiconductor Packaging, Flip-Chip Attachment, And Wafer Bonding - Q&A
Semiconductor packaging adhesives are used to attach dies or chips to the substrates on which semiconductor devices are packaged or fabricated.. Learn more about the adhesive selection process and common problems and solutions.
Primers and Surface Preparation for Proper Adhesive Wetting & Bonding - Q&A
The best way to get two things to stick together with glue is to use a primer or an adhesive promotor. You can also roughen the surface, etch the surface, or use plasma, flame, or corona surface treatments. But which is best for you? Find out here >>
Plastic Bonding with Adhesives - Considerations Q&A
Plastic bonding uses adhesives instead of fasteners to join plastic substrates together. These substrates can be made of the same type of plastic, or they can be made of different types of plastic. For design engineers who are looking for the right solution, this Q&A from Gluespec® provides answers to frequently asked questions.
Curing Two-Part Silicones? These Tips Are For You
Learn more about the positives and negatives of the various curing systems for two-part silicones
Electrically Conductive Adhesives Q&A
For design engineers who need help with electrically conductive adhesives, this Q&A from Gluespec® provides answers to frequently asked questions (FAQs) >
