RTK7659
Bond; 1-Part; Liquid; Epoxy; Heat;
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.;
PRIMA-SOLDER ME8452
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.;
PRIMA-BOND ME7159
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;
THERMOPLASTIC FILM TP7855
Bond; 1-Part; Film; Thermoplastic; Ambient Temp;
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.;
PRIMA-SOLDER ME8155-M
Solder; 1-Part; Paste; Solvent free; Heat;
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.;
COOL-BOND CB7208-EDA2
Bond; 1-Part; Liquid
; Epoxy; Elevated temperature;
A modified version of TP7208 designed to have improved bond strength at elevated temperature.;
PRIMA-SOLDER ME8418
Bond; 1-Part; Paste; Solvent-Free; Snap-Curing;
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive;
PRIMA-BOND ME7158
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;
TACK FILM TK7755
Bond; 1-Part; Liquid; Epoxy; Pressure sensitive;
A reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. ;
TP8205
Bond; 1-Part; Liquid; Thermoplastic; Pressure Sensitive;
A silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.;