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RTK7659

Bond; 1-Part; Liquid; Epoxy; Heat;
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.;

PRIMA-SOLDER ME8452

Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.;

PRIMA-BOND ME7159

Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;

THERMOPLASTIC FILM TP7855

Bond; 1-Part; Film; Thermoplastic; Ambient Temp;
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.;

PRIMA-SOLDER ME8155-M

Solder; 1-Part; Paste; Solvent free; Heat;
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.;

COOL-BOND CB7208-EDA2

Bond; 1-Part; Liquid ; Epoxy; Elevated temperature;
A modified version of TP7208 designed to have improved bond strength at elevated temperature.;

PRIMA-SOLDER ME8418

Bond; 1-Part; Paste; Solvent-Free; Snap-Curing;
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive;

PRIMA-BOND ME7158

Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;

TACK FILM TK7755

Bond; 1-Part; Liquid; Epoxy; Pressure sensitive;
A reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. ;

TP8205

Bond; 1-Part; Liquid; Thermoplastic; Pressure Sensitive;
A silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.;

RTK7659

Bond; 1-Part; Liquid; Epoxy; Heat
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.
Manufacturer: AI Technology

PRIMA-SOLDER ME8452

Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.
Manufacturer: AI Technology

PRIMA-BOND ME7159

Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
Manufacturer: AI Technology

THERMOPLASTIC FILM TP7855

Bond; 1-Part; Film; Thermoplastic; Ambient Temp
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.
Manufacturer: AI Technology

PRIMA-SOLDER ME8155-M

Solder; 1-Part; Paste; Solvent free; Heat
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.
Manufacturer: AI Technology

COOL-BOND CB7208-EDA2

Bond; 1-Part; Liquid ; Epoxy; Elevated temperature
A modified version of TP7208 designed to have improved bond strength at elevated temperature.
Manufacturer: AI Technology

PRIMA-SOLDER ME8418

Bond; 1-Part; Paste; Solvent-Free; Snap-Curing
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive
Manufacturer: AI Technology

PRIMA-BOND ME7158

Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
Manufacturer: AI Technology

TACK FILM TK7755

Bond; 1-Part; Liquid; Epoxy; Pressure sensitive
A reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier.
Manufacturer: AI Technology

TP8205

Bond; 1-Part; Liquid; Thermoplastic; Pressure Sensitive
A silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.
Manufacturer: AI Technology
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
RTK7659
AI Technology
AI Technology
Bond
1-Part
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.
PRIMA-SOLDER ME8452
AI Technology
AI Technology
Bond
1-Part
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.
PRIMA-BOND ME7159
AI Technology
AI Technology
Bond
1-Part
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
THERMOPLASTIC FILM TP7855
AI Technology
AI Technology
Bond
1-Part
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.
PRIMA-SOLDER ME8155-M
AI Technology
AI Technology
Bond; Solder
1-Part
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.
COOL-BOND CB7208-EDA2
AI Technology
AI Technology
Bond
1-Part
A modified version of TP7208 designed to have improved bond strength at elevated temperature.
PRIMA-SOLDER ME8418
AI Technology
AI Technology
Bond
1-Part
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive
PRIMA-BOND ME7158
AI Technology
AI Technology
Bond
1-Part
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
TACK FILM TK7755
AI Technology
AI Technology
Bond
1-Part
A reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier.
TP8205
AI Technology
AI Technology
Bond
1-Part
A silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.