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RTK7659
Bond; 1-Part; Liquid; Epoxy; Heat;
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.;
Manufacturer:
AI Technology
PRIMA-SOLDER ME8452
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.;
Manufacturer:
AI Technology
PRIMA-BOND ME7159
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;
Manufacturer:
AI Technology
THERMOPLASTIC FILM TP7855
Bond; 1-Part; Film; Thermoplastic; Ambient Temp;
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.;
Manufacturer:
AI Technology
PRIMA-SOLDER ME8155-M
Solder; 1-Part; Paste; Solvent free; Heat;
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.;
Manufacturer:
AI Technology
COOL-BOND CB7208-EDA2
Bond; 1-Part; Liquid
; Epoxy; Elevated temperature;
A modified version of TP7208 designed to have improved bond strength at elevated temperature.;
Manufacturer:
AI Technology
PRIMA-SOLDER ME8418
Bond; 1-Part; Paste; Solvent-Free; Snap-Curing;
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive;
Manufacturer:
AI Technology
PRIMA-BOND ME7158
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;
Manufacturer:
AI Technology
TACK FILM TK7755
Bond; 1-Part; Liquid; Epoxy; Pressure sensitive;
A reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. ;
Manufacturer:
AI Technology
TP8205
Bond; 1-Part; Liquid; Thermoplastic; Pressure Sensitive;
A silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.;
Manufacturer:
AI Technology
RTK7659
Bond; 1-Part; Liquid; Epoxy; Heat
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.
Manufacturer: AI Technology
PRIMA-SOLDER ME8452
Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.
Manufacturer: AI Technology
PRIMA-BOND ME7159
Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
Manufacturer: AI Technology
THERMOPLASTIC FILM TP7855
Bond; 1-Part; Film; Thermoplastic; Ambient Temp
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.
Manufacturer: AI Technology
PRIMA-SOLDER ME8155-M
Solder; 1-Part; Paste; Solvent free; Heat
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.
Manufacturer: AI Technology
COOL-BOND CB7208-EDA2
Bond; 1-Part; Liquid
; Epoxy; Elevated temperature
A modified version of TP7208 designed to have improved bond strength at elevated temperature.
Manufacturer: AI Technology
PRIMA-SOLDER ME8418
Bond; 1-Part; Paste; Solvent-Free; Snap-Curing
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive
Manufacturer: AI Technology
PRIMA-BOND ME7158
Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
Manufacturer: AI Technology
TACK FILM TK7755
Bond; 1-Part; Liquid; Epoxy; Pressure sensitive
A reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier.
Manufacturer: AI Technology
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
AI Technology
Bond
1-Part
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.
AI Technology
Bond
1-Part
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.
AI Technology
Bond
1-Part
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
AI Technology
Bond
1-Part
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.
AI Technology
Bond; Solder
1-Part
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.
AI Technology
Bond
1-Part
A modified version of TP7208 designed to have improved bond strength at elevated temperature.
AI Technology
Bond
1-Part
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive
AI Technology
Bond
1-Part
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
AI Technology
Bond
1-Part
A reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier.
AI Technology
Bond
1-Part
A silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.
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