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SM-110 Cleaner
Liquid Cleaner; 1-Part; Liquid; Organic Solvents; Solvent;
A mixture of organic solvents designed especially for non-aqueous cleaning applications, evaporate completely with minimal odor. No water rinse is required. High Solvency of solder paste residues. High flux loading capacity;
Manufacturer:
Alpha Metals
Alpha PV-21
Flux; 1-Part; Liquid; Alcohol based; Heat;
An alcohol based, zero halogen, halide and rosin free formulation designed to provide the attributes of excellent solderability in a standard module assembly process using popular heating (pre-heat and soldering) methods.;
Manufacturer:
Alpha Metals
Hitech AD13-9620B
Bond; 1-Part; Liquid; Epoxy; Low temperature cure;
A one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.;
Manufacturer:
Alpha Metals
Staystik 581
Bonding; 1-Part; Film; Polymerized resin; Pressure sensitive;
A silver filled electrically conductive film. It is designed for use in a variety of electronic applications. This film can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs).;
Manufacturer:
Alpha Metals
Hitech CF12-4485B
Underfilling; 1-Part; Paste; Epoxy; Low-temperature cure;
A one-component, low-temperature cure, edgebond epoxy system. It is designed to provide protection to the solder joint during mechanical stress.;
Manufacturer:
Alpha Metals
Staystik 692
Bond; 1-Part; Film; Thermoplastic; Pressure sensitive;
This thermoplastic adhesive film is designed for use in a variety of electronic applications. The properties of this adhesive make it exceptional for heat sink bonding to BGA as well as TAB bonding to PCB.;
Manufacturer:
Alpha Metals
Staystik 292
Bond; 1-Part; Paste; Fully polymerized resin; Pressure sensitive;
This thermoplastic adhesive paste is designed for use in a variety of electronic applications. Fully polymerized resin. Easily reworkable. Low modulus reduces stress to bonded materials.;
Manufacturer:
Alpha Metals
Autoclean 40
Flux remover; 1-Part; Liquid; Water-Based; Air dry;
It is an aqueous flux removal fluid designed for use at full strength. It has been formulated for efficient removal of pre and post soldering flux residues from flux spray equipment, ovens, pallets, carriers, jigs, and printed circuit assemblies.;
Manufacturer:
Alpha Metals
PV-200 Dispensing Solder Paste
Solder Paste; 1-Part; Paste; Halogen free; Heat;
It is ideal for solar panel assembly applications .This solder paste is halogen and halide free for outstanding reliability. It is designed for high speed automated or manual dispensing through a wide range of needle sizes.;
Manufacturer:
Alpha Metals
Hitech CU31-2030
Underfill; 1-Part; Liquid; Epoxy; Heat;
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties.;
Manufacturer:
Alpha Metals
SM-110 Cleaner
Liquid Cleaner; 1-Part; Liquid; Organic Solvents; Solvent
A mixture of organic solvents designed especially for non-aqueous cleaning applications, evaporate completely with minimal odor. No water rinse is required. High Solvency of solder paste residues. High flux loading capacity
Manufacturer: Alpha Metals
Alpha PV-21
Flux; 1-Part; Liquid; Alcohol based; Heat
An alcohol based, zero halogen, halide and rosin free formulation designed to provide the attributes of excellent solderability in a standard module assembly process using popular heating (pre-heat and soldering) methods.
Manufacturer: Alpha Metals
Hitech AD13-9620B
Bond; 1-Part; Liquid; Epoxy; Low temperature cure
A one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.
Manufacturer: Alpha Metals
Staystik 581
Bonding; 1-Part; Film; Polymerized resin; Pressure sensitive
A silver filled electrically conductive film. It is designed for use in a variety of electronic applications. This film can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs).
Manufacturer: Alpha Metals
Hitech CF12-4485B
Underfilling; 1-Part; Paste; Epoxy; Low-temperature cure
A one-component, low-temperature cure, edgebond epoxy system. It is designed to provide protection to the solder joint during mechanical stress.
Manufacturer: Alpha Metals
Staystik 692
Bond; 1-Part; Film; Thermoplastic; Pressure sensitive
This thermoplastic adhesive film is designed for use in a variety of electronic applications. The properties of this adhesive make it exceptional for heat sink bonding to BGA as well as TAB bonding to PCB.
Manufacturer: Alpha Metals
Staystik 292
Bond; 1-Part; Paste; Fully polymerized resin; Pressure sensitive
This thermoplastic adhesive paste is designed for use in a variety of electronic applications. Fully polymerized resin. Easily reworkable. Low modulus reduces stress to bonded materials.
Manufacturer: Alpha Metals
Autoclean 40
Flux remover; 1-Part; Liquid; Water-Based; Air dry
It is an aqueous flux removal fluid designed for use at full strength. It has been formulated for efficient removal of pre and post soldering flux residues from flux spray equipment, ovens, pallets, carriers, jigs, and printed circuit assemblies.
Manufacturer: Alpha Metals
PV-200 Dispensing Solder Paste
Solder Paste; 1-Part; Paste; Halogen free; Heat
It is ideal for solar panel assembly applications .This solder paste is halogen and halide free for outstanding reliability. It is designed for high speed automated or manual dispensing through a wide range of needle sizes.
Manufacturer: Alpha Metals
Hitech CU31-2030
Underfill; 1-Part; Liquid; Epoxy; Heat
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties.
Manufacturer: Alpha Metals
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Alpha Metals
Liquid Cleaner; Remove; Substrate Cleaner
1-Part
A mixture of organic solvents designed especially for non-aqueous cleaning applications, evaporate completely with minimal odor. No water rinse is required. High Solvency of solder paste residues. High flux loading capacity
Alpha Metals
Flux
1-Part
An alcohol based, zero halogen, halide and rosin free formulation designed to provide the attributes of excellent solderability in a standard module assembly process using popular heating (pre-heat and soldering) methods.
Alpha Metals
Bond
1-Part
A one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.
Alpha Metals
Bonding
1-Part
A silver filled electrically conductive film. It is designed for use in a variety of electronic applications. This film can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs).
Alpha Metals
Underfilling
1-Part
A one-component, low-temperature cure, edgebond epoxy system. It is designed to provide protection to the solder joint during mechanical stress.
Alpha Metals
Bond
1-Part
This thermoplastic adhesive film is designed for use in a variety of electronic applications. The properties of this adhesive make it exceptional for heat sink bonding to BGA as well as TAB bonding to PCB.
Alpha Metals
Bond
1-Part
This thermoplastic adhesive paste is designed for use in a variety of electronic applications. Fully polymerized resin. Easily reworkable. Low modulus reduces stress to bonded materials.
Alpha Metals
Flux remover
1-Part
It is an aqueous flux removal fluid designed for use at full strength. It has been formulated for efficient removal of pre and post soldering flux residues from flux spray equipment, ovens, pallets, carriers, jigs, and printed circuit assemblies.
Alpha Metals
Flux; High speed tabbing and stringing operations.; Solder Paste
1-Part
It is ideal for solar panel assembly applications .This solder paste is halogen and halide free for outstanding reliability. It is designed for high speed automated or manual dispensing through a wide range of needle sizes.
Alpha Metals
Underfill
1-Part
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties.
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