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SM-110 Cleaner

Liquid Cleaner; 1-Part; Liquid; Organic Solvents; Solvent;
A mixture of organic solvents designed especially for non-aqueous cleaning applications, evaporate completely with minimal odor. No water rinse is required. High Solvency of solder paste residues. High flux loading capacity;

Alpha PV-21

Flux; 1-Part; Liquid; Alcohol based; Heat;
An alcohol based, zero halogen, halide and rosin free formulation designed to provide the attributes of excellent solderability in a standard module assembly process using popular heating (pre-heat and soldering) methods.;

Hitech AD13-9620B

Bond; 1-Part; Liquid; Epoxy; Low temperature cure;
A one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.;

Staystik 581

Bonding; 1-Part; Film; Polymerized resin; Pressure sensitive;
A silver filled electrically conductive film. It is designed for use in a variety of electronic applications. This film can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs).;

Hitech CF12-4485B

Underfilling; 1-Part; Paste; Epoxy; Low-temperature cure;
A one-component, low-temperature cure, edgebond epoxy system. It is designed to provide protection to the solder joint during mechanical stress.;

Staystik 692

Bond; 1-Part; Film; Thermoplastic; Pressure sensitive;
This thermoplastic adhesive film is designed for use in a variety of electronic applications. The properties of this adhesive make it exceptional for heat sink bonding to BGA as well as TAB bonding to PCB.;

Staystik 292

Bond; 1-Part; Paste; Fully polymerized resin; Pressure sensitive;
This thermoplastic adhesive paste is designed for use in a variety of electronic applications. Fully polymerized resin. Easily reworkable. Low modulus reduces stress to bonded materials.;

Autoclean 40

Flux remover; 1-Part; Liquid; Water-Based; Air dry;
It is an aqueous flux removal fluid designed for use at full strength. It has been formulated for efficient removal of pre and post soldering flux residues from flux spray equipment, ovens, pallets, carriers, jigs, and printed circuit assemblies.;

PV-200 Dispensing Solder Paste

Solder Paste; 1-Part; Paste; Halogen free; Heat;
It is ideal for solar panel assembly applications .This solder paste is halogen and halide free for outstanding reliability. It is designed for high speed automated or manual dispensing through a wide range of needle sizes.;

Hitech CU31-2030

Underfill; 1-Part; Liquid; Epoxy; Heat;
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties.;

SM-110 Cleaner

Liquid Cleaner; 1-Part; Liquid; Organic Solvents; Solvent
A mixture of organic solvents designed especially for non-aqueous cleaning applications, evaporate completely with minimal odor. No water rinse is required. High Solvency of solder paste residues. High flux loading capacity
Manufacturer: Alpha Metals

Alpha PV-21

Flux; 1-Part; Liquid; Alcohol based; Heat
An alcohol based, zero halogen, halide and rosin free formulation designed to provide the attributes of excellent solderability in a standard module assembly process using popular heating (pre-heat and soldering) methods.
Manufacturer: Alpha Metals

Hitech AD13-9620B

Bond; 1-Part; Liquid; Epoxy; Low temperature cure
A one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.
Manufacturer: Alpha Metals

Staystik 581

Bonding; 1-Part; Film; Polymerized resin; Pressure sensitive
A silver filled electrically conductive film. It is designed for use in a variety of electronic applications. This film can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs).
Manufacturer: Alpha Metals

Hitech CF12-4485B

Underfilling; 1-Part; Paste; Epoxy; Low-temperature cure
A one-component, low-temperature cure, edgebond epoxy system. It is designed to provide protection to the solder joint during mechanical stress.
Manufacturer: Alpha Metals

Package Sizes

30cc syringe 50cc syringe

Staystik 692

Bond; 1-Part; Film; Thermoplastic; Pressure sensitive
This thermoplastic adhesive film is designed for use in a variety of electronic applications. The properties of this adhesive make it exceptional for heat sink bonding to BGA as well as TAB bonding to PCB.
Manufacturer: Alpha Metals

Staystik 292

Bond; 1-Part; Paste; Fully polymerized resin; Pressure sensitive
This thermoplastic adhesive paste is designed for use in a variety of electronic applications. Fully polymerized resin. Easily reworkable. Low modulus reduces stress to bonded materials.
Manufacturer: Alpha Metals

Autoclean 40

Flux remover; 1-Part; Liquid; Water-Based; Air dry
It is an aqueous flux removal fluid designed for use at full strength. It has been formulated for efficient removal of pre and post soldering flux residues from flux spray equipment, ovens, pallets, carriers, jigs, and printed circuit assemblies.
Manufacturer: Alpha Metals

PV-200 Dispensing Solder Paste

Solder Paste; 1-Part; Paste; Halogen free; Heat
It is ideal for solar panel assembly applications .This solder paste is halogen and halide free for outstanding reliability. It is designed for high speed automated or manual dispensing through a wide range of needle sizes.
Manufacturer: Alpha Metals

Hitech CU31-2030

Underfill; 1-Part; Liquid; Epoxy; Heat
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties.
Manufacturer: Alpha Metals

Package Sizes

10cc syringe 30cc syringe
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
SM-110 Cleaner
Alpha Metals
Alpha Metals
Liquid Cleaner; Remove; Substrate Cleaner
1-Part
A mixture of organic solvents designed especially for non-aqueous cleaning applications, evaporate completely with minimal odor. No water rinse is required. High Solvency of solder paste residues. High flux loading capacity
Alpha PV-21
Alpha Metals
Alpha Metals
Flux
1-Part
An alcohol based, zero halogen, halide and rosin free formulation designed to provide the attributes of excellent solderability in a standard module assembly process using popular heating (pre-heat and soldering) methods.
Hitech AD13-9620B
Alpha Metals
Alpha Metals
Bond
1-Part
A one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.
Staystik 581
Alpha Metals
Alpha Metals
Bonding
1-Part
A silver filled electrically conductive film. It is designed for use in a variety of electronic applications. This film can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs).
Hitech CF12-4485B
Alpha Metals
Alpha Metals
Underfilling
1-Part
A one-component, low-temperature cure, edgebond epoxy system. It is designed to provide protection to the solder joint during mechanical stress.
View Datasheet
Contact Rep

Interested in Package Size:

30cc syringe 50cc syringe
Staystik 692
Alpha Metals
Alpha Metals
Bond
1-Part
This thermoplastic adhesive film is designed for use in a variety of electronic applications. The properties of this adhesive make it exceptional for heat sink bonding to BGA as well as TAB bonding to PCB.
Staystik 292
Alpha Metals
Alpha Metals
Bond
1-Part
This thermoplastic adhesive paste is designed for use in a variety of electronic applications. Fully polymerized resin. Easily reworkable. Low modulus reduces stress to bonded materials.
Autoclean 40
Alpha Metals
Alpha Metals
Flux remover
1-Part
It is an aqueous flux removal fluid designed for use at full strength. It has been formulated for efficient removal of pre and post soldering flux residues from flux spray equipment, ovens, pallets, carriers, jigs, and printed circuit assemblies.
PV-200 Dispensing Solder Paste
Alpha Metals
Alpha Metals
Flux; High speed tabbing and stringing operations.; Solder Paste
1-Part
It is ideal for solar panel assembly applications .This solder paste is halogen and halide free for outstanding reliability. It is designed for high speed automated or manual dispensing through a wide range of needle sizes.
Hitech CU31-2030
Alpha Metals
Alpha Metals
Underfill
1-Part
A one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties.
View Datasheet
Contact Rep

Interested in Package Size:

10cc syringe 30cc syringe
Manufacturer | Material
Manufacturer Chemical Resistance Application Type 1 Part or 2 Part
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Alpha Metals

Liquid Cleaner

;

Remove

;

Substrate Cleaner

1-Part

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Alpha Metals

Flux

1-Part

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Alpha Metals

Bond

1-Part

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Alpha Metals

Bonding

1-Part

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Alpha Metals

Underfilling

1-Part

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Alpha Metals

Bond

1-Part

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Alpha Metals

Bond

1-Part

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Alpha Metals

Flux remover

1-Part

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Alpha Metals

Flux

;

High speed tabbing and stringing operations.

;

Solder Paste

1-Part

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Alpha Metals

Underfill

1-Part

Order Sample