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6460
Bond; 1-Part; Liquid; Epoxy; Heat;
A low viscosity, premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.;
Manufacturer:
Bondline Electronic Adhesives
6165
Adhesive; 1-Part; Liquid; Epoxy; Heat;
A premixed and frozen structural epoxy adhesive. It is formulated for high peel strength, making this tough adhesive useful for bonding dissimilar substrates.;
Manufacturer:
Bondline Electronic Adhesives
6959
Bond; 1-Part; Liquid; Epoxy; Oven cure;
A dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.;
Manufacturer:
Bondline Electronic Adhesives
2485
Bonding; 1-Part; Paste; Epoxy; Oven cure;
A silver filled, electrically conductive epoxy adhesive. This premixed, frozen and solvent free adhesive is designed for microelectronic chip bonding.;
Manufacturer:
Bondline Electronic Adhesives
7780
Bond; 1-Part; Liquid; Epoxy; Heat;
A medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, or lid sealing adhesive.;
Manufacturer:
Bondline Electronic Adhesives
6577
Bond; 1-Part; Liquid; Epoxy; Room temperature;
A medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.;
Manufacturer:
Bondline Electronic Adhesives
Bondfilm 8360
Bond; 1-Part; Film; Glass fabric; Pressure sensitive;
A high performance film adhesive. It is a glass fabric supported thermally conductive film adhesive. It is formulated to bond materials with mismatched coefficient of thermal expansion.;
Manufacturer:
Bondline Electronic Adhesives
2258
Bond; 1-Part; Liquid; Epoxy; Oven cure;
A one component electrically and thermally conductive semiconductor grade adhesive. This stress absorbing, silver filled epoxy is designed for bonding chips to substrates with a mismatch in coefficient of thermal expansion.;
Manufacturer:
Bondline Electronic Adhesives
7352
Bonding; 1-Part; Liquid; Epoxy; Oven Cure;
A premixed, frozen general purpose epoxy adhesive. It exhibits strong bonds to numerous metals, such as copper brass, gold, silver and solder. The long work life and high bonding strength makes it an excellent choice for difficult to bond metals.;
Manufacturer:
Bondline Electronic Adhesives
6158
Adhesive; 1-Part; Liquid; Epoxy-amine; Heat;
A dielectric, flexible adhesive with the following properties. It has low extractable ions which makes it suitable for the semiconductor industry.;
Manufacturer:
Bondline Electronic Adhesives
6460
Bond; 1-Part; Liquid; Epoxy; Heat
A low viscosity, premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
Manufacturer: Bondline Electronic Adhesives
6165
Adhesive; 1-Part; Liquid; Epoxy; Heat
A premixed and frozen structural epoxy adhesive. It is formulated for high peel strength, making this tough adhesive useful for bonding dissimilar substrates.
Manufacturer: Bondline Electronic Adhesives
6959
Bond; 1-Part; Liquid; Epoxy; Oven cure
A dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.
Manufacturer: Bondline Electronic Adhesives
2485
Bonding; 1-Part; Paste; Epoxy; Oven cure
A silver filled, electrically conductive epoxy adhesive. This premixed, frozen and solvent free adhesive is designed for microelectronic chip bonding.
Manufacturer: Bondline Electronic Adhesives
7780
Bond; 1-Part; Liquid; Epoxy; Heat
A medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, or lid sealing adhesive.
Manufacturer: Bondline Electronic Adhesives
6577
Bond; 1-Part; Liquid; Epoxy; Room temperature
A medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.
Manufacturer: Bondline Electronic Adhesives
Bondfilm 8360
Bond; 1-Part; Film; Glass fabric; Pressure sensitive
A high performance film adhesive. It is a glass fabric supported thermally conductive film adhesive. It is formulated to bond materials with mismatched coefficient of thermal expansion.
Manufacturer: Bondline Electronic Adhesives
2258
Bond; 1-Part; Liquid; Epoxy; Oven cure
A one component electrically and thermally conductive semiconductor grade adhesive. This stress absorbing, silver filled epoxy is designed for bonding chips to substrates with a mismatch in coefficient of thermal expansion.
Manufacturer: Bondline Electronic Adhesives
7352
Bonding; 1-Part; Liquid; Epoxy; Oven Cure
A premixed, frozen general purpose epoxy adhesive. It exhibits strong bonds to numerous metals, such as copper brass, gold, silver and solder. The long work life and high bonding strength makes it an excellent choice for difficult to bond metals.
Manufacturer: Bondline Electronic Adhesives
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Bondline Electronic Adhesives
Bond
1-Part
A low viscosity, premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
Bondline Electronic Adhesives
Adhesive
1-Part
A premixed and frozen structural epoxy adhesive. It is formulated for high peel strength, making this tough adhesive useful for bonding dissimilar substrates.
Bondline Electronic Adhesives
Bond
1-Part
A dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.
View Datasheet
Contact Rep
Contact Rep
Interested in Package Size:
1cc Syringe 3cc Disposable Syringe 5cc Disposable Syringe 10cc Disposable Syringe
Bondline Electronic Adhesives
Bonding
1-Part
A silver filled, electrically conductive epoxy adhesive. This premixed, frozen and solvent free adhesive is designed for microelectronic chip bonding.
Bondline Electronic Adhesives
Bond; Encapsulating; Sealing
1-Part
A medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, or lid sealing adhesive.
View Datasheet
Contact Rep
Contact Rep
Interested in Package Size:
1cc syringe 3cc disposable syringe 5cc disposable syringe 10cc disposable syringe
Bondline Electronic Adhesives
Bond; Encapsulating; Sealing
1-Part
A medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.
Bondline Electronic Adhesives
Bond
1-Part
A high performance film adhesive. It is a glass fabric supported thermally conductive film adhesive. It is formulated to bond materials with mismatched coefficient of thermal expansion.
Bondline Electronic Adhesives
Bond
1-Part
A one component electrically and thermally conductive semiconductor grade adhesive. This stress absorbing, silver filled epoxy is designed for bonding chips to substrates with a mismatch in coefficient of thermal expansion.
Bondline Electronic Adhesives
Bonding
1-Part
A premixed, frozen general purpose epoxy adhesive. It exhibits strong bonds to numerous metals, such as copper brass, gold, silver and solder. The long work life and high bonding strength makes it an excellent choice for difficult to bond metals.
Bondline Electronic Adhesives
Adhesive
1-Part
A dielectric, flexible adhesive with the following properties. It has low extractable ions which makes it suitable for the semiconductor industry.
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