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CC3-301AD w/ H-1 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure;
Thermally conductive, low viscosity potting resin.;
Manufacturer:
Cast-Coat Inc
CC3-402A-1 w/ H-1 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure;
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.;
Manufacturer:
Cast-Coat Inc
CC3-301AD w/ H-18 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure;
Thermally conductive, low viscosity potting resin.;
Manufacturer:
Cast-Coat Inc
CC3-402A w/ H-10LV Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure;
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.;
Manufacturer:
Cast-Coat Inc
CC3-105 w/ H-10LV Hardener
Potting; 2-Part; Liquid; Epoxy resin; 2-Part Cure;
Unfilled, Low Viscosity, General Purpose Potting Resin.;
Manufacturer:
Cast-Coat Inc
CC3-402A w/ H-18 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure;
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.;
Manufacturer:
Cast-Coat Inc
CC3-402A w/ H-1 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure;
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important. ;
Manufacturer:
Cast-Coat Inc
CC3-105 w/ H-18 Hardener
Potting; 2-Part; Liquid; Epoxy resin; 2-Part Cure;
Unfilled, Low Viscosity, General Purpose Potting Resin.;
Manufacturer:
Cast-Coat Inc
CC3-343 A/B
Conformal Coating; 2-Part; Liquid; Epoxy; 2-Part Cure;
A unique dielectric coating that offers excellent heat transfer while providing exceptionally high electrical isolation. It is recommended for coating printed circuit boards and especially heatsink assemblies.;
Manufacturer:
Cast-Coat Inc
Chemical Resistance:
Resistive to most chemicals
CC3-341 w/ H-10LV Hardener
Bond; 2-Part; Liquid; Epoxy; 2-Part Cure;
A two-part, thermally conductive thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks.;
Manufacturer:
Cast-Coat Inc
CC3-301AD w/ H-1 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure
Thermally conductive, low viscosity potting resin.
Manufacturer: Cast-Coat Inc
CC3-402A-1 w/ H-1 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Manufacturer: Cast-Coat Inc
CC3-301AD w/ H-18 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure
Thermally conductive, low viscosity potting resin.
Manufacturer: Cast-Coat Inc
CC3-402A w/ H-10LV Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Manufacturer: Cast-Coat Inc
CC3-105 w/ H-10LV Hardener
Potting; 2-Part; Liquid; Epoxy resin; 2-Part Cure
Unfilled, Low Viscosity, General Purpose Potting Resin.
Manufacturer: Cast-Coat Inc
CC3-402A w/ H-18 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Manufacturer: Cast-Coat Inc
CC3-402A w/ H-1 Hardener
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Manufacturer: Cast-Coat Inc
CC3-105 w/ H-18 Hardener
Potting; 2-Part; Liquid; Epoxy resin; 2-Part Cure
Unfilled, Low Viscosity, General Purpose Potting Resin.
Manufacturer: Cast-Coat Inc
CC3-343 A/B
Conformal Coating; 2-Part; Liquid; Epoxy; 2-Part Cure
A unique dielectric coating that offers excellent heat transfer while providing exceptionally high electrical isolation. It is recommended for coating printed circuit boards and especially heatsink assemblies.
Manufacturer: Cast-Coat Inc
Chemical Resistance: Resistive to most chemicals
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Cast-Coat Inc
Encapsulant; Potting
2-Part
Thermally conductive, low viscosity potting resin.
Cast-Coat Inc
Potting
2-Part
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Cast-Coat Inc
Encapsulant; Potting
2-Part
Thermally conductive, low viscosity potting resin.
Cast-Coat Inc
Potting
2-Part
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Cast-Coat Inc
Bonding; Lamination; Potting; See Through Castings
2-Part
Unfilled, Low Viscosity, General Purpose Potting Resin.
Cast-Coat Inc
Potting
2-Part
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Cast-Coat Inc
Potting
2-Part
A general purpose, fire retardant epoxy potting resin exhibiting low abrasion resistance. It is designed to be used where low viscosity and good wetting-out properties are important.
Cast-Coat Inc
Bonding; Lamination; Potting; See Through Castings
2-Part
Unfilled, Low Viscosity, General Purpose Potting Resin.
Cast-Coat Inc
Resistive to most chemicals
Conformal Coating
2-Part
A unique dielectric coating that offers excellent heat transfer while providing exceptionally high electrical isolation. It is recommended for coating printed circuit boards and especially heatsink assemblies.
Cast-Coat Inc
Bond
2-Part
A two-part, thermally conductive thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks.
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