Epoxibond EB-350-4T
Adhesive; 1-Part; Liquid; Epoxy; Heat Cured;
A single-part heat cured toughened epoxy adhesive. The epoxy combines the structural strength of conventional epoxies with unparalleled peel, impact, and cleavage resistance.;
Epoxibond EB-102/EH-12 (100:200)
Bonding; 2-Part; Liquid; Epoxy; 2-Part cure;
An unfilled, medium viscosity epoxy system suitable for bonding, potting and encapsulating, coating, and sealing applications. It offers high bond strength, vibration & shock resistance.;
Epoxiohm EO-21 w/ EH-9 Hardener
Bond; 2-Part; Liquid; Epoxy; Heat;
It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and bond strength to a wide variety of substrates.;
Epoxibond EB-486-ALAN
Bond; 2-Part; Paste; Epoxy; 2-Part Cure;
A highly thermally conductive, high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. ;
Epoxiohm EO-97M
Bond; 1-Part; Liquid; Epoxy; Heat;
A one part, silver filled, high electrical conductivity, epoxy adhesive for die attach, semiconductor and other
microelectronics applications. It provides for fine pitch resolution, when syringe dispensed, stencil printed, or screenprinted. ;
STG-40
Grease; 1-Part; Grease; Non-reactive; None;
A non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal
resistance with a soft, non-flowable consistency. Low bleed and evaporation.;
Epoxibond-107LP2
Adhesive; 2-Part; Liquid; Epoxy; 2-Part Cure;
A two components - optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life,
and good handling characteristics.;
Epoxibond EB-315 w/ EH-3 Hardener
Bond; 2-Part; Liquid; Epoxy; 2-Part Cure;
A highly filled, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance.;
CTG-81
Grease; 1-Part; Grease; Non-Silicone; Non-curing;
Non-silicone; non-curing, silver filled electrically and thermally conductive grease. It can be used as interfacial contact for electrical and thermal transfer for power devices.;
Epoxibond EB-350-3FL-LV
Bond; 1-Part; Liquid; Epoxy; Heat cured;
One part, heat cured epoxy resin system provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.;