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Magic ASP338-28 F1510
Solder; 1-Part; Paste; Halogen zero formulation; Solder;
It is a patented high reliability material that increases life time performance with wide band gap material SiC and GaN.;
Manufacturer:
Heraeus
PC 3201
Bond; 1-Part; Liquid; Epoxy; Heat;
A thermosetting, one-component, solvent-free, silver-filled epoxy conductive adhesive, designed for the connection of electronic (SMDs) and bare dies with ceramic substrates, PCB and lead frames.;
Manufacturer:
Heraeus
PD 955 PY
Bond; 1-Part; Liquid; Polymer; Heat;
A thermosetting single component, solvent-free polymer adhesive, developed especially for the surface mounting of SMT components onto PCBs and for use on bare substrates.;
Manufacturer:
Heraeus
C8830 Silver Conductor Paste
Conductor paste; 1-Part; Paste; Lead-free; Heat;
A one-component, lead-free, low temperature and screen printable silver conductor. It exhibits excellent solderability on a wide range of glass substrates.;
Manufacturer:
Heraeus
LTC3501 Polymer Conductor
Bond; 1-Part; Liquid; Polymer conductor; Heat;
A screen printable polymer conductor designed to have good acceptance of lead free solders. It is a low temperature curing material with excellent adhesion on a variety of substrates.;
Manufacturer:
Heraeus
Chemical Resistance:
Excellent solvent resistant
NCA 9-9280
Bond; 1-Part; Liquid; Epoxy; Snap curing system;
A fast curing thermosetting, one-component, solvent-free, high flexible non-conductive adhesive epoxy. Snap curing system. Low temperature curing.;
Manufacturer:
Heraeus
LTC3302 Polymer Silver Conductor
Bond; 1-Part; Liquid; Polymer based silver conductor; Heat;
A screen printable polymer based silver conductor. It contains a fast curing, single component polymer system. Has low resistivity and excellent solvent resistance.;
Manufacturer:
Heraeus
Chemical Resistance:
Excellent solvent resistance
PC 4001
Bond; 1-Part; Liquid; Epoxy; Heat;
A thermosetting, one-component, solvent-free, silver-filled epoxy conductive adhesive with reduced silver content, designed for the connection of SMT components and bare dies on ceramic substrates lead frames.;
Manufacturer:
Heraeus
LTR4911 Graphene Ink
Bond; 1-Part; Liquid; Graphene-enabled; Heat;
A screen printable, graphene-enabled conductive ink for low temperature applications. When properly cured,
has good adhesion to most untreated and treated flexible plastic films such as polyester.
;
Manufacturer:
Heraeus
PD5110 Silicone Insulator White
Conformal Coating; 1-Part; Liquid; Silicone; Heat;
A screen printable, modified silicone coating used for circuit protection. The cured film exhibits outstanding resistance to solvent attacks.;
Manufacturer:
Heraeus
Chemical Resistance:
Chemically inert; The cured film exhibits outstanding resistance to
solvent attacks
Magic ASP338-28 F1510
Solder; 1-Part; Paste; Halogen zero formulation; Solder
It is a patented high reliability material that increases life time performance with wide band gap material SiC and GaN.
Manufacturer: Heraeus
PC 3201
Bond; 1-Part; Liquid; Epoxy; Heat
A thermosetting, one-component, solvent-free, silver-filled epoxy conductive adhesive, designed for the connection of electronic (SMDs) and bare dies with ceramic substrates, PCB and lead frames.
Manufacturer: Heraeus
PD 955 PY
Bond; 1-Part; Liquid; Polymer; Heat
A thermosetting single component, solvent-free polymer adhesive, developed especially for the surface mounting of SMT components onto PCBs and for use on bare substrates.
Manufacturer: Heraeus
C8830 Silver Conductor Paste
Conductor paste; 1-Part; Paste; Lead-free; Heat
A one-component, lead-free, low temperature and screen printable silver conductor. It exhibits excellent solderability on a wide range of glass substrates.
Manufacturer: Heraeus
LTC3501 Polymer Conductor
Bond; 1-Part; Liquid; Polymer conductor; Heat
A screen printable polymer conductor designed to have good acceptance of lead free solders. It is a low temperature curing material with excellent adhesion on a variety of substrates.
Manufacturer: Heraeus
Chemical Resistance: Excellent solvent resistant
NCA 9-9280
Bond; 1-Part; Liquid; Epoxy; Snap curing system
A fast curing thermosetting, one-component, solvent-free, high flexible non-conductive adhesive epoxy. Snap curing system. Low temperature curing.
Manufacturer: Heraeus
LTC3302 Polymer Silver Conductor
Bond; 1-Part; Liquid; Polymer based silver conductor; Heat
A screen printable polymer based silver conductor. It contains a fast curing, single component polymer system. Has low resistivity and excellent solvent resistance.
Manufacturer: Heraeus
Chemical Resistance: Excellent solvent resistance
PC 4001
Bond; 1-Part; Liquid; Epoxy; Heat
A thermosetting, one-component, solvent-free, silver-filled epoxy conductive adhesive with reduced silver content, designed for the connection of SMT components and bare dies on ceramic substrates lead frames.
Manufacturer: Heraeus
LTR4911 Graphene Ink
Bond; 1-Part; Liquid; Graphene-enabled; Heat
A screen printable, graphene-enabled conductive ink for low temperature applications. When properly cured,
has good adhesion to most untreated and treated flexible plastic films such as polyester.
Manufacturer: Heraeus
PD5110 Silicone Insulator White
Conformal Coating; 1-Part; Liquid; Silicone; Heat
A screen printable, modified silicone coating used for circuit protection. The cured film exhibits outstanding resistance to solvent attacks.
Manufacturer: Heraeus
Chemical Resistance: Chemically inert; The cured film exhibits outstanding resistance to
solvent attacks
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Heraeus
Solder
1-Part
It is a patented high reliability material that increases life time performance with wide band gap material SiC and GaN.
Heraeus
Bond
1-Part
A thermosetting, one-component, solvent-free, silver-filled epoxy conductive adhesive, designed for the connection of electronic (SMDs) and bare dies with ceramic substrates, PCB and lead frames.
Heraeus
Bond
1-Part
A thermosetting single component, solvent-free polymer adhesive, developed especially for the surface mounting of SMT components onto PCBs and for use on bare substrates.
Heraeus
Conductor paste
1-Part
A one-component, lead-free, low temperature and screen printable silver conductor. It exhibits excellent solderability on a wide range of glass substrates.
Heraeus
Excellent solvent resistant
Bond
1-Part
A screen printable polymer conductor designed to have good acceptance of lead free solders. It is a low temperature curing material with excellent adhesion on a variety of substrates.
Heraeus
Bond
1-Part
A fast curing thermosetting, one-component, solvent-free, high flexible non-conductive adhesive epoxy. Snap curing system. Low temperature curing.
Heraeus
Excellent solvent resistance
Bond
1-Part
A screen printable polymer based silver conductor. It contains a fast curing, single component polymer system. Has low resistivity and excellent solvent resistance.
Heraeus
Bond
1-Part
A thermosetting, one-component, solvent-free, silver-filled epoxy conductive adhesive with reduced silver content, designed for the connection of SMT components and bare dies on ceramic substrates lead frames.
Heraeus
Bond
1-Part
A screen printable, graphene-enabled conductive ink for low temperature applications. When properly cured,
has good adhesion to most untreated and treated flexible plastic films such as polyester.
Heraeus
Chemically inert; The cured film exhibits outstanding resistance to
solvent attacks
Conformal Coating
1-Part
A screen printable, modified silicone coating used for circuit protection. The cured film exhibits outstanding resistance to solvent attacks.
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