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3541 Flux

Solder flux; 1-Part; Liquid; Rosin; None;
A low solids flux specially formulated to be used for wave soldering where the solder cleaning process has been eliminated.;

BP – 3106 Flux Vehicle

Solder flux; 1-Part; Paste; Tin; Solder;
A nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems.;

2212-15

Wave Solder Flux; 1-Part; Liquid; Rosin-containing fluxes; Solder;
Wave solder flux is particularly effective for soldering large and thick circuit boards or for selective soldering operations where long heat profiles are required. It helps to ensure greater surface insulation resistance and overall reliability.;

WS-3600

Solder Flux; 1-Part; Liquid; Halogen-containing; Solder;
A thixotropic flux designed for use in pin transfer applications for ball-attachment to substrates. ;

Wave Solder Flux Series 2212

Wave solder flux; 1-Part; Liquid; Non-Hygroscopic; None;
These fluxes are particularly effective for soldering large and thick circuit boards, The residue left by Wave Soldering Flux Series #2212 is hard, non-hygroscopic, non-tacky, and transparent.;

16-2212

Thinner; 1-Part; Liquid; Solvent-Based; Solvent;
Solvent based liquid thinner.;

Wave Flux 2036

Flux; 1-Part; Liquid; Alcohol; None;
A non-activated rosin flux blended with pure alcohol and water white rosin Provides good solderability, best for use in high-reliability applications without removal.;

WS-676

Flux; 1-Part; Liquid; Halogen-Free; None;
A NIA halogen-free water-soluble ball-attach flux designed for use in pin transfer applications for ball-attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres.;

16-1000

Thinner; 1-Part; Liquid; Solvent-Based; Solvent;
Solvent based liquid thinner.;

AuSn Preforms for Die Attach Application

Die attach application; 1-Part; Preforms; Pb-free; Solder;
• High tensile strength • High corrosive resistance • Compatible with other precious metals • High-temperature strength • Good thermal fatigue properties.;

3541 Flux

Solder flux; 1-Part; Liquid; Rosin; None
A low solids flux specially formulated to be used for wave soldering where the solder cleaning process has been eliminated.
Manufacturer: Indium

BP – 3106 Flux Vehicle

Solder flux; 1-Part; Paste; Tin; Solder
A nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems.
Manufacturer: Indium

2212-15

Wave Solder Flux; 1-Part; Liquid; Rosin-containing fluxes; Solder
Wave solder flux is particularly effective for soldering large and thick circuit boards or for selective soldering operations where long heat profiles are required. It helps to ensure greater surface insulation resistance and overall reliability.
Manufacturer: Indium

WS-3600

Solder Flux; 1-Part; Liquid; Halogen-containing; Solder
A thixotropic flux designed for use in pin transfer applications for ball-attachment to substrates.
Manufacturer: Indium

Package Sizes

100g Jars

Wave Solder Flux Series 2212

Wave solder flux; 1-Part; Liquid; Non-Hygroscopic; None
These fluxes are particularly effective for soldering large and thick circuit boards, The residue left by Wave Soldering Flux Series #2212 is hard, non-hygroscopic, non-tacky, and transparent.
Manufacturer: Indium

16-2212

Thinner; 1-Part; Liquid; Solvent-Based; Solvent
Solvent based liquid thinner.
Manufacturer: Indium

Wave Flux 2036

Flux; 1-Part; Liquid; Alcohol; None
A non-activated rosin flux blended with pure alcohol and water white rosin Provides good solderability, best for use in high-reliability applications without removal.
Manufacturer: Indium

WS-676

Flux; 1-Part; Liquid; Halogen-Free; None
A NIA halogen-free water-soluble ball-attach flux designed for use in pin transfer applications for ball-attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres.
Manufacturer: Indium

16-1000

Thinner; 1-Part; Liquid; Solvent-Based; Solvent
Solvent based liquid thinner.
Manufacturer: Indium

AuSn Preforms for Die Attach Application

Die attach application; 1-Part; Preforms; Pb-free; Solder
• High tensile strength • High corrosive resistance • Compatible with other precious metals • High-temperature strength • Good thermal fatigue properties.
Manufacturer: Indium
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
3541 Flux
Indium
Indium
Solder flux
1-Part
A low solids flux specially formulated to be used for wave soldering where the solder cleaning process has been eliminated.
BP – 3106 Flux Vehicle
Indium
Indium
Solder flux
1-Part
A nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems.
2212-15
Indium
Indium
Wave Solder Flux
1-Part
Wave solder flux is particularly effective for soldering large and thick circuit boards or for selective soldering operations where long heat profiles are required. It helps to ensure greater surface insulation resistance and overall reliability.
WS-3600
Indium
Indium
Solder Flux
1-Part
A thixotropic flux designed for use in pin transfer applications for ball-attachment to substrates.
View Datasheet
Contact Rep

Interested in Package Size:

100g Jars
Wave Solder Flux Series 2212
Indium
Indium
Wave solder flux
1-Part
These fluxes are particularly effective for soldering large and thick circuit boards, The residue left by Wave Soldering Flux Series #2212 is hard, non-hygroscopic, non-tacky, and transparent.
16-2212
Indium
Indium
Thinner
1-Part
Solvent based liquid thinner.
Wave Flux 2036
Indium
Indium
Flux
1-Part
A non-activated rosin flux blended with pure alcohol and water white rosin Provides good solderability, best for use in high-reliability applications without removal.
WS-676
Indium
Indium
Flux
1-Part
A NIA halogen-free water-soluble ball-attach flux designed for use in pin transfer applications for ball-attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres.
16-1000
Indium
Indium
Thinner
1-Part
Solvent based liquid thinner.
AuSn Preforms for Die Attach Application
Indium
Indium
Die attach application
1-Part
• High tensile strength • High corrosive resistance • Compatible with other precious metals • High-temperature strength • Good thermal fatigue properties.