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G566A
Thermal adhesive; 1-Part; Sheet; Artificial graphite; Pressure sensitive;
An artificial graphite sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700 W/m*K. It is flexible and bendable, which is suitable for thin products and high capability mobile devices.;
Manufacturer:
Lipoly
NT93-s
Absorber Pad; 1-Part; Pad; Soft magnetic materials
dispersed in a non-silicone resin; Pressure Sensitive;
A thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.;
Manufacturer:
Lipoly
NT92-s
Absorber Pad; 1-Part; Pad; Soft magnetic materials dispersed in a non-silicone resin; Pressure Sensitive;
A thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin.
It has a thermal conductivity of 2.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.;
Manufacturer:
Lipoly
D2000
Thermal grease; 2-Part; Grease; Silicone; 2-Part cure;
A two-part curable thermal grease. It can be cured quickly at room temperature and high temperature without pump-out effect. With a thermal conductivity of 2.0 W/m*K, has low thermal resistance.;
Manufacturer:
Lipoly
S818
Gap filler; 1-Part; Pad; Silicone; Pressure sensitive;
High ductile thermal conductivity. Having good stretchability. The toughness structure can enhance the operability and durability of material. ROHS & REACH compliant.;
Manufacturer:
Lipoly
PK605
Gap filling; 1-Part; Pad; Silicone; Pressure sensitive;
A material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is shore OO/60 with high flexibility, high compressibility, high insulating, great self-adhesive.;
Manufacturer:
Lipoly
PR27
Insulated Thermal Conductive Film; 1-Part; Film; Polyimide Film; Pressure sensitive;
High insulator with a thickness of 0.15mm. It uses polyimide film as the reinforcement material. It’s suitable for high power transistors, electrical equipment, and will be the best choice for auto-distribution systems.;
Manufacturer:
Lipoly
BS75K
Gap filling; 1-Part; Gel pad; Silicone; Pressure sensitive;
An ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. It offers excellent compression under minimal force. ROHS & REACH compliant.;
Manufacturer:
Lipoly
AT900A (0.25 mm)
Bond; Tape; Fiberglass reinforced layer; Pressure sensitive;
A thermally conductive tape. With a fiberglass reinforced layer and a thermal conductivity of 0.9 W/m*K this product is designed for applications where additional durability is needed.;
Manufacturer:
Lipoly
S-putty
Gap filler; 1-Part; Putty; Silicone; Air dry;
A one-part dispensable material with thermal conductivity 3.5W/m*K. Ideally suited for dispensing using the dispensing robot. For any high compression and low stress application.;
Manufacturer:
Lipoly
G566A
Thermal adhesive; 1-Part; Sheet; Artificial graphite; Pressure sensitive
An artificial graphite sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700 W/m*K. It is flexible and bendable, which is suitable for thin products and high capability mobile devices.
Manufacturer: Lipoly
NT93-s
Absorber Pad; 1-Part; Pad; Soft magnetic materials
dispersed in a non-silicone resin; Pressure Sensitive
A thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
Manufacturer: Lipoly
NT92-s
Absorber Pad; 1-Part; Pad; Soft magnetic materials dispersed in a non-silicone resin; Pressure Sensitive
A thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin.
It has a thermal conductivity of 2.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
Manufacturer: Lipoly
D2000
Thermal grease; 2-Part; Grease; Silicone; 2-Part cure
A two-part curable thermal grease. It can be cured quickly at room temperature and high temperature without pump-out effect. With a thermal conductivity of 2.0 W/m*K, has low thermal resistance.
Manufacturer: Lipoly
S818
Gap filler; 1-Part; Pad; Silicone; Pressure sensitive
High ductile thermal conductivity. Having good stretchability. The toughness structure can enhance the operability and durability of material. ROHS & REACH compliant.
Manufacturer: Lipoly
PK605
Gap filling; 1-Part; Pad; Silicone; Pressure sensitive
A material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is shore OO/60 with high flexibility, high compressibility, high insulating, great self-adhesive.
Manufacturer: Lipoly
PR27
Insulated Thermal Conductive Film; 1-Part; Film; Polyimide Film; Pressure sensitive
High insulator with a thickness of 0.15mm. It uses polyimide film as the reinforcement material. It’s suitable for high power transistors, electrical equipment, and will be the best choice for auto-distribution systems.
Manufacturer: Lipoly
BS75K
Gap filling; 1-Part; Gel pad; Silicone; Pressure sensitive
An ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. It offers excellent compression under minimal force. ROHS & REACH compliant.
Manufacturer: Lipoly
AT900A (0.25 mm)
Bond; Tape; Fiberglass reinforced layer; Pressure sensitive
A thermally conductive tape. With a fiberglass reinforced layer and a thermal conductivity of 0.9 W/m*K this product is designed for applications where additional durability is needed.
Manufacturer: Lipoly
S-putty
Gap filler; 1-Part; Putty; Silicone; Air dry
A one-part dispensable material with thermal conductivity 3.5W/m*K. Ideally suited for dispensing using the dispensing robot. For any high compression and low stress application.
Manufacturer: Lipoly
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Lipoly
Thermal adhesive
1-Part
An artificial graphite sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700 W/m*K. It is flexible and bendable, which is suitable for thin products and high capability mobile devices.
Lipoly
Absorber Pad
1-Part
A thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
Lipoly
Absorber Pad
1-Part
A thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin.
It has a thermal conductivity of 2.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
Lipoly
Thermal grease
2-Part
A two-part curable thermal grease. It can be cured quickly at room temperature and high temperature without pump-out effect. With a thermal conductivity of 2.0 W/m*K, has low thermal resistance.
Lipoly
Gap filler
1-Part
High ductile thermal conductivity. Having good stretchability. The toughness structure can enhance the operability and durability of material. ROHS & REACH compliant.
Lipoly
Gap filling
1-Part
A material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is shore OO/60 with high flexibility, high compressibility, high insulating, great self-adhesive.
Lipoly
Insulated Thermal Conductive Film
1-Part
High insulator with a thickness of 0.15mm. It uses polyimide film as the reinforcement material. It’s suitable for high power transistors, electrical equipment, and will be the best choice for auto-distribution systems.
Lipoly
Gap filling
1-Part
An ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. It offers excellent compression under minimal force. ROHS & REACH compliant.
Lipoly
Bond
A thermally conductive tape. With a fiberglass reinforced layer and a thermal conductivity of 0.9 W/m*K this product is designed for applications where additional durability is needed.
Lipoly
Gap filler
1-Part
A one-part dispensable material with thermal conductivity 3.5W/m*K. Ideally suited for dispensing using the dispensing robot. For any high compression and low stress application.
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