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NGAC G907-59
Bond; 2-Part; Liquid; Epoxy; Room temperature;
A clear, low viscosity, room temperature curable epoxy adhesive system with excellent flowability. This 2-part system adheres strongly to glass, ceramics, most metals and plastics.;
Manufacturer:
Nextgen Adhesives
NGAC G907-52
Bonding; 2-Part; Liquid; Epoxy; Room temperature cure;
A low viscosity and room temperature curable epoxy adhesive. This-2 part system adheres strongly to glass, ceramics, most metals and plastics.;
Manufacturer:
Nextgen Adhesives
NGAC P907-30 MOD1
Encapsulant; 1-Part; Liquid; Unknown;
A high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage.;
Manufacturer:
Nextgen Adhesives
NGAC P907-86
Bond; 2-Part; Liquid; Epoxy; Room temperature;
A fast gelling and room temperature curable clear epoxy adhesive system designed for optical applications where quick green strength and fast curing is required.;
Manufacturer:
Nextgen Adhesives
NGAC P910-27
Encapsulant; 1-Part; Liquid; Unknown; Heat;
Low viscosity encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance. Uses include protecting wire bonds and bare die.;
Manufacturer:
Nextgen Adhesives
NGAC G907-27
Bonding; 2-Part; Liquid; Polyamide; 2-Part cure;
A medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications. Provides excellent chemical resistance, as well as, overall toughness.;
Manufacturer:
Nextgen Adhesives
Chemical Resistance:
Excellent
NGAC TC907-09
Bonding; 2-Part; Liquid; Epoxy; Room temperature curing;
A medium viscosity, electrically insulating and room temperature curing adhesive designed for staking and setting heat sensitive components in printed circuit board applications.;
Manufacturer:
Nextgen Adhesives
Chemical Resistance:
Highly resistant to chemicals
NGAC P907-03
Bond; 2-Part; Liquid; Unknown; Room Temperature Curing;
A low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.;
Manufacturer:
Nextgen Adhesives
NGAC G907-67
Bond; 2-Part; Liquid; Epoxy; 2-Part cure;
A sky blue and low viscosity casting adhesive formulated for casting applications requiring minimal shrinkage, long pot life, good flexibility and excellent impact strength.;
Manufacturer:
Nextgen Adhesives
Chemical Resistance:
Excellent
NGAC TC907-40
Bond; 2-Part; Liquid; Epoxy; Room temperature cure;
A thermally conductive and electrically insulating adhesive which can be cured at room temperature. It was designed for applications requiring the combination of excellent thermal transfer and flexibility.;
Manufacturer:
Nextgen Adhesives
Chemical Resistance:
Highly resistant to chemicals
NGAC G907-59
Bond; 2-Part; Liquid; Epoxy; Room temperature
A clear, low viscosity, room temperature curable epoxy adhesive system with excellent flowability. This 2-part system adheres strongly to glass, ceramics, most metals and plastics.
Manufacturer: Nextgen Adhesives
NGAC G907-52
Bonding; 2-Part; Liquid; Epoxy; Room temperature cure
A low viscosity and room temperature curable epoxy adhesive. This-2 part system adheres strongly to glass, ceramics, most metals and plastics.
Manufacturer: Nextgen Adhesives
NGAC P907-30 MOD1
Encapsulant; 1-Part; Liquid; Unknown
A high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage.
Manufacturer: Nextgen Adhesives
NGAC P907-86
Bond; 2-Part; Liquid; Epoxy; Room temperature
A fast gelling and room temperature curable clear epoxy adhesive system designed for optical applications where quick green strength and fast curing is required.
Manufacturer: Nextgen Adhesives
NGAC P910-27
Encapsulant; 1-Part; Liquid; Unknown; Heat
Low viscosity encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance. Uses include protecting wire bonds and bare die.
Manufacturer: Nextgen Adhesives
NGAC G907-27
Bonding; 2-Part; Liquid; Polyamide; 2-Part cure
A medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications. Provides excellent chemical resistance, as well as, overall toughness.
Manufacturer: Nextgen Adhesives
Chemical Resistance: Excellent
NGAC TC907-09
Bonding; 2-Part; Liquid; Epoxy; Room temperature curing
A medium viscosity, electrically insulating and room temperature curing adhesive designed for staking and setting heat sensitive components in printed circuit board applications.
Manufacturer: Nextgen Adhesives
Chemical Resistance: Highly resistant to chemicals
NGAC P907-03
Bond; 2-Part; Liquid; Unknown; Room Temperature Curing
A low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.
Manufacturer: Nextgen Adhesives
NGAC G907-67
Bond; 2-Part; Liquid; Epoxy; 2-Part cure
A sky blue and low viscosity casting adhesive formulated for casting applications requiring minimal shrinkage, long pot life, good flexibility and excellent impact strength.
Manufacturer: Nextgen Adhesives
Chemical Resistance: Excellent
NGAC TC907-40
Bond; 2-Part; Liquid; Epoxy; Room temperature cure
A thermally conductive and electrically insulating adhesive which can be cured at room temperature. It was designed for applications requiring the combination of excellent thermal transfer and flexibility.
Manufacturer: Nextgen Adhesives
Chemical Resistance: Highly resistant to chemicals
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Nextgen Adhesives
Bond; Repair
2-Part
A clear, low viscosity, room temperature curable epoxy adhesive system with excellent flowability. This 2-part system adheres strongly to glass, ceramics, most metals and plastics.
Nextgen Adhesives
Bonding; Casting; Potting
2-Part
A low viscosity and room temperature curable epoxy adhesive. This-2 part system adheres strongly to glass, ceramics, most metals and plastics.
Nextgen Adhesives
Bond; Encapsulant
1-Part
A high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage.
Nextgen Adhesives
Bond
2-Part
A fast gelling and room temperature curable clear epoxy adhesive system designed for optical applications where quick green strength and fast curing is required.
Nextgen Adhesives
Bonding; Encapsulant
1-Part
Low viscosity encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance. Uses include protecting wire bonds and bare die.
Nextgen Adhesives
Excellent
Bonding
2-Part
A medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications. Provides excellent chemical resistance, as well as, overall toughness.
Nextgen Adhesives
Highly resistant to chemicals
Bonding
2-Part
A medium viscosity, electrically insulating and room temperature curing adhesive designed for staking and setting heat sensitive components in printed circuit board applications.
Nextgen Adhesives
Bond
2-Part
A low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.
Nextgen Adhesives
Excellent
Bond; Casting
2-Part
A sky blue and low viscosity casting adhesive formulated for casting applications requiring minimal shrinkage, long pot life, good flexibility and excellent impact strength.
Nextgen Adhesives
Highly resistant to chemicals
Bond
2-Part
A thermally conductive and electrically insulating adhesive which can be cured at room temperature. It was designed for applications requiring the combination of excellent thermal transfer and flexibility.
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