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Resinlab Materials Grid


UR3010

Encapsulate; 2 Part; Liquid; TDI; Heat;
A two component, room temperature curing polyurethane potting system. It is designed to cure completely at room temperature. ;

UR1049

Bond; 2 Part; Polyurethane Foam; Urethane; Part A/Part B;
A two component, Cream, water blown, 4 lb per cubic foot, MDI based rigid polyurethane foam system. It is designed to cure completely at room temperature. It provides excellent environmental protection and thermal insulation properties.;

EP11HT

Bond; 2 Part; Thixotropic paste; Epoxy; Part A/Part B;
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.;

EP1200 Black

Casting Resin; 2 Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;

EP750

Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy structural adhesive, room temperature to a tough, semi-rigid polymer, good wetting and adhesion to most surfaces and has a free flowing viscosity, very good resistance, ASTM E-595 for outgassing.;

EP1026

Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy adhesive, a tough semi-rigid material, and is free flowing in viscosity, good resistance, MMD equipment.;

EP1282 Black

Encapsulate; 2 Part; Liquid; Epoxy; 2-Part Cure;
A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.;

EP1121 Black

Encapsulate; 2 Part; Liquid; Epoxy; Part A/Part B;
It is a two-part, unfilled epoxy encapsulant designed for medium to large sized castings. It cures completely at room temperature to a tough, flexible yet soft polymer. ;

CA6014

Bond; 1 Part; Liquid; Cyanoacrylate; Pressure Sensitive;
Single component solvent free materials. Substrate such as wood, plastics, metal, rubber, or other materials are bonded quickly and effectively with this product. These products are less dependent on surface moisture for achieving cure speed than most standard grades of cyanoacrylates.;

EP1290

Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part mineral filled epoxy adhesive, room temperature to a tough, semi-flexible material, good wetting to most surfaces, good resistance to water, salt spray, inorganic acids and bases and most organic solvents.;

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Resinlab

Encapsulate

;

Potting

2 Part

Liquid

Order Sample

Resinlab

Bond

2 Part

Polyurethane Foam

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Resinlab

Bond

2 Part

Thixotropic paste

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Resinlab

Bond

;

Casting Resin

;

Potting

2 Part

Liquid

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Resinlab

Bond

2 Part

Liquid

Order Sample

Resinlab

Bond

2 Part

Liquid

Order Sample

Resinlab

Encapsulate

2 Part

Liquid

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Resinlab

Encapsulate

2 Part

Liquid

Order Sample

Resinlab

Bond

;

Instant Adhesives

1 Part

Liquid

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Resinlab

Bond

2 Part

Liquid

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