TIM-GAP HTC-16 (0.5 mm)
Gap Filler; 1-Part; Sheet; Silicone; None;
A highly thermally conductive gap filler sheet, specially designed for high heat flux applications to achieve low thermal resistance and efficient cooling.;
TIM-GAP 1128 (1.5 mm)
Thermal interface gap filler; 1-Part; Pad; Silicone; Pressure sensitive;
A soft, thermal interface gap filler pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications. It will provide superb protection against damage due to deformation as well as shock or vibration.;
TIM-GAP 1161 (1.0 mm)
Thermal interface gap filler; 1-Part; Pad; Silicone polymer; Pressure sensitive;
A soft easily compressible thermal interface gap filler pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity, low thermal resistance and conformability.;
TIM-GAP 1115 (3.0 mm)
Thermal
interface gap filler; 1-Part; Pad; Silicone; Pressure sensitive;
A highly conformable thermal interface gap filler pad. It has high thermal conductivity and conformability for low stress applications. It will provide superb protection against damage due to deformation as well as shock or vibration;
TIM-GAP 1161 (0.5 mm)
Thermal interface gap filler; 1-Part; Pad; Silicone polymer; Pressure sensitive;
A soft easily compressible thermal interface gap filler pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity, low thermal resistance and conformability.;
TIM-GAP 1115 (2.5 mm)
Thermal
interface gap filler; 1-Part; Pad; Silicone; Pressure sensitive;
A highly conformable thermal interface gap filler pad. It has high thermal conductivity and conformability for low stress applications. It will provide superb protection against damage due to deformation as well as shock or vibration;
TIM-GAP 1128 (1.0 mm)
Thermal interface gap filler; 1-Part; Pad; Silicone; Pressure sensitive;
A soft, thermal interface gap filler pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications. It will provide superb protection against damage due to deformation as well as shock or vibration.;
TIM-GAP HTC-16 (0.3 mm)
Gap Filler; 1-Part; Sheet; Silicone; None;
A highly thermally conductive gap filler sheet, specially designed for high heat flux applications to achieve low thermal resistance and efficient cooling.;
TIM-GAP 1128 (0.5 mm)
Thermal interface gap filler; 1-Part; Pad; Silicone; Pressure sensitive;
A soft, thermal interface gap filler pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications. It will provide superb protection against damage due to deformation as well as shock or vibration.;
TIM-GAP NS (3.0 mm)
Gap Filler; 1-Part; Sheet; Non-Silicone; None;
A thermally conductive Non-Silicone gap filler sheet, specially designed where silicone contamination or outgassing cannot be tolerated in sensitive applications. Offers excellent thermal performance in electronic applications.;