The cured product exhibits low shrinkage and excellent thermal, water and chemical resistance. Typical applications include bonding of optical connectors, fibers, lenses, prisms and other electronic components where low shrinkage and low outgassing are required.;
An epoxy based, medium viscosity, cationic-curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a high strength, chemical resistant, low out-gassing polymer system capable of surviving exposure up to 200° C. ;
Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.
*This is a summary description only. No decision on usability should be made based solely on this summary info.
Gluespec makes no warranty or guarantee that the information on our Website, product data sheets, product descriptions, prices or other content is current, accurate, complete, reliable, suitable for a particular purpose or error-free. Consult the relevant manufacturer's website and product data sheet for more information.
Please test and evaluate materials carefully to ensure compliance with all specifications and requirements of your application.
We have no control over the conditions of use of materials, so (even if you use the Ask an ESR feature) it is solely up to you to independently determine the efficacy, suitability, performance and safety of the material for your application.