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Specialty Materials Compatible with Copper Grid


DSP31-401

Bond; 1 Part; Dot; Hot melt; Pressure-Sensitive;
Stiff adhesive with medium peel strength and medium shear strength. Stronger bond, may tear paper.;
Manufacturer: Glue Dots
Substrate: Copper; Aluminum; Ceramic; Fabric; General; Glass; Metal; Paper; Plastic; Polycarbonate; Polyester; Polypropylene; PVC; Rubber; Stainless Steel; Steel; Wood

EP11HT

Bond; 2 Part; Thixotropic paste; Epoxy; Part A/Part B;
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.;
Manufacturer: Resinlab
Substrate: Copper; Ceramic; Aluminum, 2024 T3 Aluminum Abraded/Mek wipe; Fabric; Glass; Metal; Neoprene; Nylon; Other various substrates; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

Scotch-Weld Epoxy Adhesive 2216 B/A Gray

Bond; 2 Part; Liquid; Modified Epoxy; Room Temperature cure;
It is a flexible, two-part, room temperature curing epoxy with high peel and shear strength, Resistant to extreme shock, vibration, and flexing.;
Manufacturer: 3M
Substrate: Copper; ABS Alloy; Aluminum , Etched Aluminum ; Brass; Cold rolled Steel, Steel; Epoxy; Galvanized Steel; Galvanized Steel; Glass; Masonry; Metal; Plastic; Polyphenylene Oxide; Rubber; Stainless Steel; Styrene Butadiene Rubber; Wood

3748

Bond; 1 Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer: 3M
Substrate: Copper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Corrugated; Douglas Fir; Epoxy, Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Paper; Phenolic; Plastics; Polycarbonate; PolyEthylene, Polyethylene (High Density) ; Polyolefins; Polypropylene, Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard

DP460

Bond; 2 Part; Liquid; Epoxy; Base/Accelerator;
Long worklife toughened epoxy • 2-4 hrs. handling strength;
Manufacturer: 3M
Substrate: Copper (Abrade); ABS; Brass, Brass (Abrade); Cold rolled Steel (Abrade), Steel, Cold Rolled Steel (Abraded) , Cold Rolled Steel (Oakite degrease) ; Etched Aluminum, Aluminum, Aluminum(Abrade); FRP; Galvanized Steel (Electrodeposited), Galvanized Steel (Hot dipped) , Galvanized Steel (Oakite degrease) ; Galvanized Steel (Electrodeposited), Galvanized Steel (Oakite degrease) , Galvanized Steel (Hot dipped) ; Metal; Neoprene; Phenolic; PolyAcrylic; Polycarbonate; Polystryene; PVC; SBR; Stainless Steel (Abrade)

DP100FR

Bond; 2 Part; Liquid; Epoxy; Base/Accelerator;
25-30 min. handling strength • Meets UL94V-0 rating • Self-extinguishing version of DP100;
Manufacturer: 3M
Substrate: Copper; ABS; Aluminum, Etched Aluminum; Brass; Cold rolled Steel, Steel; FRP; Galvanized Steel; Galvanized Steel; Glass; Neoprene; Nitrile; Plastic; PolyAcrylic; Polycarbonate; PVC; Rubber; SBR; Stainless Steel

EP1200 Black

Casting Resin; 2 Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;
Manufacturer: Resinlab
Substrate: Copper; Ceramic; Aluminum; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

EP1026

Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy adhesive, a tough semi-rigid material, and is free flowing in viscosity, good resistance, MMD equipment.;
Manufacturer: Resinlab
Substrate: Copper; Ceramic; Aluminum, 2024 T3 Aluminum Abraded/Mek wipe; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

EP750

Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy structural adhesive, room temperature to a tough, semi-rigid polymer, good wetting and adhesion to most surfaces and has a free flowing viscosity, very good resistance, ASTM E-595 for outgassing.;
Manufacturer: Resinlab
Substrate: Copper; Ceramic; Aluminum; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

EP1121 Black

Encapsulate; 2 Part; Liquid; Epoxy; Part A/Part B;
It is a two-part, unfilled epoxy encapsulant designed for medium to large sized castings. It cures completely at room temperature to a tough, flexible yet soft polymer. ;
Manufacturer: Resinlab
Substrate: Copper; Ceramic; Aluminum; Fabric; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Copper

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Aluminum

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Ceramic

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Fabric

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General

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Glass

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Metal

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Paper

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Plastic

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Polycarbonate

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Polyester

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Polypropylene

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PVC

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Rubber

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Stainless Steel

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Steel

;

Wood

Bond

1 Part

Dot

Order Sample

Copper

;

Ceramic

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Aluminum, 2024 T3 Aluminum Abraded/Mek wipe

;

Fabric

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Glass

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Metal

;

Neoprene

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Nylon

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Other various substrates

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Plastic

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Polycarbonate

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Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

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Steel

;

Stone

;

Wood

Bond

2 Part

Thixotropic paste

Order Sample

Copper

;

ABS Alloy

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Aluminum , Etched Aluminum

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Brass

;

Cold rolled Steel, Steel

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Epoxy

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Galvanized Steel

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Galvanized Steel

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Glass

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Masonry

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Metal

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Plastic

;

Polyphenylene Oxide

;

Rubber

;

Stainless Steel

;

Styrene Butadiene Rubber

;

Wood

Bond

2 Part

Liquid

Order Sample

Copper

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ABS

;

Acrylic

;

Canvas

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Carbon

;

Ceramic

;

Coated Cardboard

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Coated Chipboard

;

Corrugated

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Douglas Fir

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Epoxy, Epoxy Glass FR-4

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Fabric

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Flexible foam

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FRP

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Glass

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Laminate

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Metal

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Paper

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Phenolic

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Plastics

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Polycarbonate

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PolyEthylene, Polyethylene (High Density)

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Polyolefins

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Polypropylene, Polypropylene (High Density)

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Polystyrene Foam

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Polystyrene Foam

;

Uncoated Card Board

;

Uncoated Chipboard

Bond

1 Part

Sticks

Order Sample

Copper (Abrade)

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ABS

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Brass, Brass (Abrade)

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Cold rolled Steel (Abrade), Steel, Cold Rolled Steel (Abraded) , Cold Rolled Steel (Oakite degrease)

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Etched Aluminum, Aluminum, Aluminum(Abrade)

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FRP

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Galvanized Steel (Electrodeposited), Galvanized Steel (Hot dipped) , Galvanized Steel (Oakite degrease)

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Galvanized Steel (Electrodeposited), Galvanized Steel (Oakite degrease) , Galvanized Steel (Hot dipped)

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Metal

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Neoprene

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Phenolic

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PolyAcrylic

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Polycarbonate

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Polystryene

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PVC

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SBR

;

Stainless Steel (Abrade)

Bond

2 Part

Liquid

Order Sample

Copper

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ABS

;

Aluminum, Etched Aluminum

;

Brass

;

Cold rolled Steel, Steel

;

FRP

;

Galvanized Steel

;

Galvanized Steel

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Glass

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Neoprene

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Nitrile

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Plastic

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PolyAcrylic

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Polycarbonate

;

PVC

;

Rubber

;

SBR

;

Stainless Steel

Bond

2 Part

Liquid

Order Sample

Copper

;

Ceramic

;

Aluminum

;

Fabric

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

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Polyester

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Polyvinyl chloride (PVC)

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Rubber

;

Steel

;

Stone

;

Wood

Bond

;

Casting Resin

;

Potting

2 Part

Liquid

Order Sample

Copper

;

Ceramic

;

Aluminum, 2024 T3 Aluminum Abraded/Mek wipe

;

Fabric

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Bond

2 Part

Liquid

Order Sample

Copper

;

Ceramic

;

Aluminum

;

Fabric

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Bond

2 Part

Liquid

Order Sample

Copper

;

Ceramic

;

Aluminum

;

Fabric

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Encapsulate

2 Part

Liquid

Order Sample
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