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Key Specs
Application Type
Manufacturer
Industry
Chemistry
Fabric
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7610

Bond; 1 Part; Paste; Urethane; Moisture;
Single-pack, moisture cure urethane adhesive/sealant.;
Manufacturer: Parker Lord
Substrate: Fabrics; ABS; Especially precoated metals; Grit Blasted Aluminum; Grit Blasted CRS; Marine Grade Plywood; Metals; Plastics; Polycarbonate; Scuffed FRP; Scuffed SMC; Solvent-Wiped Glass; Stone; TPU; Wood
Chemical Resistance: Solvent

300 General Purpose Spray Adhesive

Bond; 1 Part; Aerosol; Hexane; Solvent;
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer: Camie Campbell
Substrate: Fabric; Cardboard; Fiberglass; Foil; Leather; Metal; Paper; Plastic; Porous; Wood
Chemical Resistance: Good

3748

Bond; 1 Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer: 3M
Substrate: Fabric; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Flexible foam; FRP; Glass; Laminate; Metal; Paper; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density) ; Polyolefins; Polypropylene; Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard

Loctite 401

Bond; 1 Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer: Henkel
Substrate: Fabric; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Leather; Metals; Neoprene; Nitrile; Nylon; Paper; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance: Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance

3762

Bond; 1 Part; Stick; EVA; Hot melt;
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood;
Manufacturer: 3M
Substrate: Fabric; Beadboard; ChipBoard; Coated Cardboard; Coated Chipboard; Corrugated; Douglas Fir ; Flexible foam; Paper; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Cardboard; Uncoated Chipboard; Wood

EP11HT

Bond; 2 Part; Thixotropic paste; Epoxy; Part A/Part B;
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.;
Manufacturer: Resinlab
Substrate: Fabric; Ceramic; 2024 T3 Aluminum Abraded/Mek wipe; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Other various substrates; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Chemical Resistance: Good resistance to water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray

EP1200 Black

Casting Resin; 2 Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;
Manufacturer: Resinlab
Substrate: Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Chemical Resistance: Inorganic acids; Inorganic bases; Organic solvents; Salt spray; Water

EP750

Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy structural adhesive, room temperature to a tough, semi-rigid polymer, good wetting and adhesion to most surfaces and has a free flowing viscosity, very good resistance, ASTM E-595 for outgassing.;
Manufacturer: Resinlab
Substrate: Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Chemical Resistance: Good Water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray

EP1026

Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy adhesive, a tough semi-rigid material, and is free flowing in viscosity, good resistance, MMD equipment.;
Manufacturer: Resinlab
Substrate: Fabric; Ceramic; 2024 T3 Aluminum Abraded/Mek wipe; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Chemical Resistance: Good resistance to water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray

EP1282 Black

Encapsulate; 2 Part; Liquid; Epoxy; 2-Part Cure;
A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.;
Manufacturer: Resinlab
Substrate: Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Chemical Resistance: Very good resistance to bases; Very good resistance to inorganic acids; Very good resistance to most organic solvents; Very good resistance to water

7610

Bond; 1 Part; Paste; Urethane; Moisture
Single-pack, moisture cure urethane adhesive/sealant.
Manufacturer: Parker Lord
Substrate: Fabrics; ABS; Especially precoated metals; Grit Blasted Aluminum; Grit Blasted CRS; Marine Grade Plywood; Metals; Plastics; Polycarbonate; Scuffed FRP; Scuffed SMC; Solvent-Wiped Glass; Stone; TPU; Wood
Chemical Resistance: Solvent

300 General Purpose Spray Adhesive

Bond; 1 Part; Aerosol; Hexane; Solvent
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Manufacturer: Camie Campbell
Substrate: Fabric; Cardboard; Fiberglass; Foil; Leather; Metal; Paper; Plastic; Porous; Wood
Chemical Resistance: Good

Package Sizes

Spray

3748

Bond; 1 Part; Sticks; Hot melt; Hot melt
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Manufacturer: 3M
Substrate: Fabric; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Flexible foam; FRP; Glass; Laminate; Metal; Paper; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density) ; Polyolefins; Polypropylene; Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard

Loctite 401

Bond; 1 Part; Liquid; Ethyl cyanoacrylate; Humidity
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
Manufacturer: Henkel
Substrate: Fabric; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Leather; Metals; Neoprene; Nitrile; Nylon; Paper; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance: Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance

3762

Bond; 1 Part; Stick; EVA; Hot melt
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
Manufacturer: 3M
Substrate: Fabric; Beadboard; ChipBoard; Coated Cardboard; Coated Chipboard; Corrugated; Douglas Fir ; Flexible foam; Paper; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Cardboard; Uncoated Chipboard; Wood

EP11HT

Bond; 2 Part; Thixotropic paste; Epoxy; Part A/Part B
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.
Manufacturer: Resinlab
Substrate: Fabric; Ceramic; 2024 T3 Aluminum Abraded/Mek wipe; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Other various substrates; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Chemical Resistance: Good resistance to water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray

EP1200 Black

Casting Resin; 2 Part; Liquid; Epoxy; Part A/Part B
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.

EP750

Bond; 2 Part; Liquid; Epoxy; Part A/Part B
A two part unfilled epoxy structural adhesive, room temperature to a tough, semi-rigid polymer, good wetting and adhesion to most surfaces and has a free flowing viscosity, very good resistance, ASTM E-595 for outgassing.

EP1026

Bond; 2 Part; Liquid; Epoxy; Part A/Part B
A two part unfilled epoxy adhesive, a tough semi-rigid material, and is free flowing in viscosity, good resistance, MMD equipment.
Manufacturer: Resinlab
Substrate: Fabric; Ceramic; 2024 T3 Aluminum Abraded/Mek wipe; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Chemical Resistance: Good resistance to water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray

EP1282 Black

Encapsulate; 2 Part; Liquid; Epoxy; 2-Part Cure
A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.
Substrate
Chemical Resistance
Application Type
1 Part or 2 Part (1 Part)
Description
7610
Parker Lord
Fabrics; ABS; Especially precoated metals; Grit Blasted Aluminum; Grit Blasted CRS; Marine Grade Plywood; Metals; Plastics; Polycarbonate; Scuffed FRP; Scuffed SMC; Solvent-Wiped Glass; Stone; TPU; Wood
Solvent
Bond; Seal
1 Part
Single-pack, moisture cure urethane adhesive/sealant.
300 General Purpose Spray Adhesive
Camie Campbell
Fabric; Cardboard; Fiberglass; Foil; Leather; Metal; Paper; Plastic; Porous; Wood
Good
Bond
1 Part
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
View Datasheet

Interested in Package Size:

Spray
3748
3M
Fabric; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Flexible foam; FRP; Glass; Laminate; Metal; Paper; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density) ; Polyolefins; Polypropylene; Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
Bond
1 Part
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Loctite 401
Henkel
Fabric; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Leather; Metals; Neoprene; Nitrile; Nylon; Paper; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance
Bond; Instant Adhesives
1 Part
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
3762
3M
Fabric; Beadboard; ChipBoard; Coated Cardboard; Coated Chipboard; Corrugated; Douglas Fir ; Flexible foam; Paper; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Cardboard; Uncoated Chipboard; Wood
Bond; Repair; Seal
1 Part
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
View Datasheet

Interested in Package Size:

.45 x 12 5/8 x 2 5/8 x 8 1 in x 3 in
EP11HT
Resinlab
Fabric; Ceramic; 2024 T3 Aluminum Abraded/Mek wipe; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Other various substrates; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Good resistance to water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray
Bond
2 Part
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.
EP1200 Black
Resinlab
Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Inorganic acids; Inorganic bases; Organic solvents; Salt spray; Water
Bond; Casting Resin; Potting
2 Part
EP750
Resinlab
Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Good Water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray
Bond
2 Part
EP1026
Resinlab
Fabric; Ceramic; 2024 T3 Aluminum Abraded/Mek wipe; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Good resistance to water; Inorganic acids; Inorganic bases; Organic solvents; Salt spray
Bond
2 Part
EP1282 Black
Resinlab
Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
Very good resistance to bases; Very good resistance to inorganic acids; Very good resistance to most organic solvents; Very good resistance to water
Encapsulate
2 Part
Manufacturer | Material
Substrate Chemical Resistance Application Type 1 Part or 2 Part (1 Part)
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Fabrics

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ABS

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Especially precoated metals

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Grit Blasted Aluminum

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Grit Blasted CRS

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Marine Grade Plywood

;

Metals

;

Plastics

;

Polycarbonate

;

Scuffed FRP

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Scuffed SMC

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Solvent-Wiped Glass

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Stone

;

TPU

;

Wood

Solvent

Bond

;

Seal

1 Part

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Fabric

;

Cardboard

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Fiberglass

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Foil

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Leather

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Metal

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Paper

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Plastic

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Porous

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Wood

Good

Bond

1 Part

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Fabric

;

ABS

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Acrylic

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Canvas

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Carbon

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Ceramic

;

Coated Cardboard

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Coated Chipboard

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Copper

;

Corrugated

;

Douglas Fir

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Epoxy

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Epoxy Glass FR-4

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Flexible foam

;

FRP

;

Glass

;

Laminate

;

Metal

;

Paper

;

Phenolic

;

Plastics

;

Polycarbonate

;

PolyEthylene

;

Polyethylene (High Density)

;

Polyolefins

;

Polypropylene

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Polypropylene (High Density)

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Polystyrene Foam

;

Polystyrene Foam

;

Uncoated Card Board

;

Uncoated Chipboard

Bond

1 Part

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Fabric

;

ABS

;

Absorbent materials

;

Acrylic

;

Aluminum (etched)

;

Buna-N

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Ceramic

;

Chipboard

;

Difficult-to-bond materials

;

Elastomers

;

Leather

;

Metals

;

Neoprene

;

Nitrile

;

Nylon

;

Paper

;

Phenolic

;

Plastics

;

Polycarbonate

;

Polyester

;

Porous

;

PVC

;

Rubber

;

Steel (degreased)

;

Steel (grit blasted)

;

Wood

;

Wood (Balsa)

;

Wood (Oak)

;

Zinc Dichromate

Ethanol

;

Freon TA

;

Isopropanol

;

Isopropyl alcohol

;

Motor Oil

;

Solvent

;

Unleaded gasoline

;

Water/glycol resistance

Bond

;

Instant Adhesives

1 Part

Order Sample

Fabric

;

Beadboard

;

ChipBoard

;

Coated Cardboard

;

Coated Chipboard

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Corrugated

;

Douglas Fir

;

Flexible foam

;

Paper

;

PolyEthylene

;

Polystyrene Foam

;

Polystyrene Foam

;

Uncoated Cardboard

;

Uncoated Chipboard

;

Wood

Bond

;

Repair

;

Seal

1 Part

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Fabric

;

Ceramic

;

2024 T3 Aluminum Abraded/Mek wipe

;

Aluminum

;

Copper

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Other various substrates

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Good resistance to water

;

Inorganic acids

;

Inorganic bases

;

Organic solvents

;

Salt spray

Bond

2 Part

Order Sample

Fabric

;

Ceramic

;

Aluminum

;

Copper

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Inorganic acids

;

Inorganic bases

;

Organic solvents

;

Salt spray

;

Water

Bond

;

Casting Resin

;

Potting

2 Part

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Fabric

;

Ceramic

;

Aluminum

;

Copper

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Good Water

;

Inorganic acids

;

Inorganic bases

;

Organic solvents

;

Salt spray

Bond

2 Part

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Fabric

;

Ceramic

;

2024 T3 Aluminum Abraded/Mek wipe

;

Aluminum

;

Copper

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Good resistance to water

;

Inorganic acids

;

Inorganic bases

;

Organic solvents

;

Salt spray

Bond

2 Part

Order Sample

Fabric

;

Ceramic

;

Aluminum

;

Copper

;

Glass

;

Metal

;

Neoprene

;

Nylon

;

Plastic

;

Polycarbonate

;

Polyester

;

Polyvinyl chloride (PVC)

;

Rubber

;

Steel

;

Stone

;

Wood

Very good resistance to bases

;

Very good resistance to inorganic acids

;

Very good resistance to most organic solvents

;

Very good resistance to water

Encapsulate

2 Part

Order Sample