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Specialty Materials Compatible with Fabric Grid
7610
Bond; 1 Part; Paste; Polyurethane; Moisture;
Single-pack, moisture cure urethane adhesive/sealant.;
Manufacturer:
Parker Lord
Substrate:
Fabrics; ABS; Especially precoated metals; Grit Blasted Aluminum; Grit Blasted CRS; Marine Grade Plywood; Metals; Plastics; Polycarbonate; Scuffed FRP; Scuffed SMC; Solvent-Wiped Glass; Stone; Wood
300 General Purpose Spray Adhesive
Bond; 1 Part; Aerosol; Hexane; Solvent;
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer:
Camie Campbell
Substrate:
Fabric; Cardboard; Fiberglass; Foil; Leather; Metal; Paper; Plastic; Porous; Wood
DSP31-401
Bond; 1 Part; Dot; Hot melt; Pressure-Sensitive;
Stiff adhesive with medium peel strength and medium shear strength. Stronger bond, may tear paper.;
Manufacturer:
Glue Dots
Substrate:
Fabric; Aluminum; Ceramic; Copper; General; Glass; Metal; Paper; Plastic; Polycarbonate; Polyester; Polypropylene; PVC; Rubber; Stainless Steel; Steel; Wood
EP11HT
Bond; 2 Part; Thixotropic paste; Epoxy; Part A/Part B;
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.;
Manufacturer:
Resinlab
Substrate:
Fabric; Ceramic; Aluminum, 2024 T3 Aluminum Abraded/Mek wipe; Copper; Glass; Metal; Neoprene; Nylon; Other various substrates; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
3748
Bond; 1 Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer:
3M
Substrate:
Fabric; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy, Epoxy Glass FR-4; Flexible foam; FRP; Glass; Laminate; Metal; Paper; Phenolic; Plastics; Polycarbonate; PolyEthylene, Polyethylene (High Density)
; Polyolefins; Polyolefins; Polypropylene, Polypropylene (High Density)
; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
EP1200 Black
Casting Resin; 2 Part; Liquid; Epoxy; Part A/Part B;
A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.;
Manufacturer:
Resinlab
Substrate:
Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
EP750
Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy structural adhesive, room temperature to a tough, semi-rigid polymer, good wetting and adhesion to most surfaces and has a free flowing viscosity, very good resistance, ASTM E-595 for outgassing.;
Manufacturer:
Resinlab
Substrate:
Fabric; Ceramic; Aluminum; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
3762
Bond; 1 Part; Stick; EVA; Hot melt;
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood;
Manufacturer:
3M
Substrate:
Fabric; Beadboard; ChipBoard; Coated Cardboard; Coated Chipboard; Corrugated; Douglas Fir
; Flexible foam; Paper; PolyEthylene; Polystyrene Foam; Uncoated Cardboard; Uncoated Chipboard; Wood
Loctite 401
Bond; 1 Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer:
Henkel
Substrate:
Fabric; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Leather; Metals; Neoprene; Nitrile; Nylon; Paper; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased), Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
EP1026
Bond; 2 Part; Liquid; Epoxy; Part A/Part B;
A two part unfilled epoxy adhesive, a tough semi-rigid material, and is free flowing in viscosity, good resistance, MMD equipment.;
Manufacturer:
Resinlab
Substrate:
Fabric; Ceramic; Aluminum, 2024 T3 Aluminum Abraded/Mek wipe; Copper; Glass; Metal; Neoprene; Nylon; Plastic; Polycarbonate; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
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