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Key Specs
Application Type
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160 Coverall Tan Blockout Enamel

Enamel; 1-Part; Liquid; Acetone; Solvent;
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer: Camie Campbell
Substrate: Cardboard; Metal; Wood

3762

Bond; 1-Part; Stick; EVA; Hot melt;
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood;
Manufacturer: 3M
Substrate: Coated Cardboard; Corrugated; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Douglas Fir ; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood

300 General Purpose Spray Adhesive

Bond; 1-Part; Aerosol; Hexane; Solvent;
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer: Camie Campbell
Substrate: Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Chemical Resistance: Good

3738

Bond; 1-Part; Pellets; Hot melt; Hot melt;
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard;
Manufacturer: 3M
Substrate: Paper; Plain and coated corrugated; Uncoated Cardboard; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood

3748

Bond; 1-Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer: 3M
Substrate: Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density) ; Polyolefins; Polypropylene; Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard

Loctite 401

Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer: Henkel
Substrate: Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance: Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance

Thermogrip 2109

Bond; 1-Part; Stick; Hot melt; Hot melt;
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.;
Manufacturer: Bostik
Substrate: CardBoard; Paper; Foams; Porous; Wood
Chemical Resistance: Acids; Alkalies; Chemical resistance; Water

1357

Bond; 1-Part; Liquid; Acetone; Solvent;
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.;
Manufacturer: 3M
Substrate: Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood

HM-324

Adhesive; 1-Part; Pellets; EVA; Hot melt;
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.;
Manufacturer: Elemelt
Substrate: Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek

3120 RTV Silicone Rubber w/ 1 Catalyst 5:1

Encapsulate; 2-Part; Liquid; Silicone rubber surfaces; Base/Catalyst;
Low tear strength, high durometer, excellent heat stability.;
Manufacturer: Dow
Substrate: Paper; Aluminum foil; Metal; Plastic; Polyesters

160 Coverall Tan Blockout Enamel

Enamel; 1-Part; Liquid; Acetone; Solvent
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Manufacturer: Camie Campbell
Substrate: Cardboard; Metal; Wood

Package Sizes

Tan Black Spray

3762

Bond; 1-Part; Stick; EVA; Hot melt
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
Manufacturer: 3M
Substrate: Coated Cardboard; Corrugated; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Douglas Fir ; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood

300 General Purpose Spray Adhesive

Bond; 1-Part; Aerosol; Hexane; Solvent
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Manufacturer: Camie Campbell
Substrate: Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Chemical Resistance: Good

Package Sizes

Spray

3738

Bond; 1-Part; Pellets; Hot melt; Hot melt
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard
Manufacturer: 3M
Substrate: Paper; Plain and coated corrugated; Uncoated Cardboard; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood

3748

Bond; 1-Part; Sticks; Hot melt; Hot melt
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Manufacturer: 3M
Substrate: Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density) ; Polyolefins; Polypropylene; Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard

Loctite 401

Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
Manufacturer: Henkel
Substrate: Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance: Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance

Thermogrip 2109

Bond; 1-Part; Stick; Hot melt; Hot melt
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.
Manufacturer: Bostik
Substrate: CardBoard; Paper; Foams; Porous; Wood
Chemical Resistance: Acids; Alkalies; Chemical resistance; Water

1357

Bond; 1-Part; Liquid; Acetone; Solvent
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.
Manufacturer: 3M
Substrate: Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood

HM-324

Adhesive; 1-Part; Pellets; EVA; Hot melt
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.
Manufacturer: Elemelt
Substrate: Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek

Package Sizes

50 lb Carton

3120 RTV Silicone Rubber w/ 1 Catalyst 5:1

Encapsulate; 2-Part; Liquid; Silicone rubber surfaces; Base/Catalyst
Low tear strength, high durometer, excellent heat stability.
Manufacturer: Dow
Substrate: Paper; Aluminum foil; Metal; Plastic; Polyesters
Substrate
Chemical Resistance
Application Type
1 Part or 2 Part
Description
160 Coverall Tan Blockout Enamel
Camie Campbell
Cardboard; Metal; Wood
Coat; Enamel
1-Part
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.
View Datasheet
Contact Rep

Interested in Package Size:

Tan Black Spray
3762
3M
Coated Cardboard; Corrugated; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Douglas Fir ; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood
Bond; Repair; Seal
1-Part
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
300 General Purpose Spray Adhesive
Camie Campbell
Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Good
Bond
1-Part
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
View Datasheet
Contact Rep

Interested in Package Size:

Spray
3738
3M
Paper; Plain and coated corrugated; Uncoated Cardboard; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood
Bond; Seal
1-Part
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard
3748
3M
Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density) ; Polyolefins; Polypropylene; Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
Bond
1-Part
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Loctite 401
Henkel
Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance
Bond; Instant Adhesives
1-Part
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
Thermogrip 2109
Bostik
CardBoard; Paper; Foams; Porous; Wood
Acids; Alkalies; Chemical resistance; Water
Bond
1-Part
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.
1357
3M
Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
Bond
1-Part
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.
HM-324
Elemelt
Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
Adhesive
1-Part
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.
View Datasheet
Contact Rep

Interested in Package Size:

50 lb Carton
3120 RTV Silicone Rubber w/ 1 Catalyst 5:1
Dow
Paper; Aluminum foil; Metal; Plastic; Polyesters
Encapsulate; Mold-Making; Pot
2-Part
Low tear strength, high durometer, excellent heat stability.
Manufacturer | Material
Substrate Chemical Resistance Application Type 1 Part or 2 Part
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Cardboard

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Metal

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Wood

Coat

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Enamel

1-Part

Order Sample

Coated Cardboard

;

Corrugated

;

Paper

;

Uncoated Cardboard

;

Beadboard

;

ChipBoard

;

Coated Chipboard

;

Douglas Fir

;

Fabric

;

Flexible foam

;

PolyEthylene

;

Polystyrene Foam

;

Polystyrene Foam

;

Uncoated Chipboard

;

Wood

Bond

;

Repair

;

Seal

1-Part

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Cardboard

;

Paper

;

Fabric

;

Fiberglass

;

Foil

;

Leather

;

Metal

;

Plastic

;

Porous

;

Wood

Good

Bond

1-Part

Order Sample

Paper

;

Plain and coated corrugated

;

Uncoated Cardboard

;

ABS

;

Canvas

;

Chipboard

;

Douglas fir

;

Fabric

;

Flexible Foam

;

Foams

;

FRP

;

Laminate

;

Leather

;

Many plastics

;

Masonite

;

Other lightweight materials

;

Plastic

;

Polycarbonate

;

PolyEthylene

;

Polyolefins

;

Polystyrene Foam

;

Polystyrene Foam

;

Rigid Vinyl

;

Sand cores

;

Uncoated Chipboard

;

Wood

Bond

;

Seal

1-Part

Order Sample

Coated Cardboard

;

Paper

;

ABS

;

Acrylic

;

Canvas

;

Carbon

;

Ceramic

;

Coated Chipboard

;

Copper

;

Corrugated

;

Douglas Fir

;

Epoxy

;

Epoxy Glass FR-4

;

Fabric

;

Flexible foam

;

FRP

;

Glass

;

Laminate

;

Metal

;

Phenolic

;

Plastics

;

Polycarbonate

;

PolyEthylene

;

Polyethylene (High Density)

;

Polyolefins

;

Polypropylene

;

Polypropylene (High Density)

;

Polystyrene Foam

;

Polystyrene Foam

;

Uncoated Card Board

;

Uncoated Chipboard

Bond

1-Part

Order Sample

Paper

;

ABS

;

Absorbent materials

;

Acrylic

;

Aluminum (etched)

;

Buna-N

;

Ceramic

;

Chipboard

;

Difficult-to-bond materials

;

Elastomers

;

Fabric

;

Leather

;

Metals

;

Neoprene

;

Nitrile

;

Nylon

;

Phenolic

;

Plastics

;

Polycarbonate

;

Polyester

;

Porous

;

PVC

;

Rubber

;

Steel (degreased)

;

Steel (grit blasted)

;

Wood

;

Wood (Balsa)

;

Wood (Oak)

;

Zinc Dichromate

Ethanol

;

Freon TA

;

Isopropanol

;

Isopropyl alcohol

;

Motor Oil

;

Solvent

;

Unleaded gasoline

;

Water/glycol resistance

Bond

;

Instant Adhesives

1-Part

Order Sample

CardBoard

;

Paper

;

Foams

;

Porous

;

Wood

Acids

;

Alkalies

;

Chemical resistance

;

Water

Bond

1-Part

Order Sample

Paper

;

Paper Honeycomb

;

Birch

;

Cloth

;

Decorative plastic laminates

;

Foamed Glass

;

Foamed Glass

;

Laminates

;

Many other substrates

;

Metal

;

Most rubber

;

Plastic

;

Plastic laminates

;

Wood

Bond

1-Part

Order Sample

Paper

;

Metal

;

Polycarbonate

;

Polypropylene

;

polystyrene

;

Tyvek

Adhesive

1-Part

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Paper

;

Aluminum foil

;

Metal

;

Plastic

;

Polyesters

Encapsulate

;

Mold-Making

;

Pot

2-Part

Order Sample