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160 Coverall Tan Blockout Enamel
Enamel; 1-Part; Liquid; Acetone; Solvent;
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer:
Camie Campbell
Substrate:
Cardboard; Metal; Wood
Loctite 401
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer:
Henkel
Substrate:
Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance:
Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Solvent; Unleaded gasoline; Water/glycol resistance
300 General Purpose Spray Adhesive
Bond; 1-Part; Aerosol; Hexane; Solvent;
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer:
Camie Campbell
Substrate:
Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Chemical Resistance:
Good
3748
Bond; 1-Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer:
3M
Substrate:
Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density)
; Polyolefins; Polypropylene; Polypropylene (High Density)
; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
3762
Bond; 1-Part; Stick; EVA; Hot melt;
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood;
Manufacturer:
3M
Substrate:
Coated Cardboard; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Corrugated; Douglas Fir
; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood
Thermogrip 2109
Bond; 1-Part; Stick; Hot melt; Hot melt;
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.;
Manufacturer:
Bostik
Substrate:
CardBoard; Paper; Foams; Porous; Wood
Chemical Resistance:
Acids; Alkalies; Chemical resistance; Water
3120 RTV Silicone Rubber w/ 1 Catalyst 5:1
Encapsulate; 2-Part; Liquid; Silicone rubber surfaces; Base/Catalyst;
Low tear strength, high durometer, excellent heat stability.;
Manufacturer:
Dow
Substrate:
Paper; Aluminum foil; Metal; Plastic; Polyesters
1357
Bond; 1-Part; Liquid; Acetone; Solvent;
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.;
Manufacturer:
3M
Substrate:
Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
3738
Bond; 1-Part; Pellets; Hot melt; Hot melt;
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard;
Manufacturer:
3M
Substrate:
Paper; Uncoated Cardboard; ABS; Canvas; Chipboard; Coated corrugated; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plain corrugated; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood
HM-324
Adhesive; 1-Part; Pellets; EVA; Hot melt;
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.;
Manufacturer:
Elemelt
Substrate:
Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
160 Coverall Tan Blockout Enamel
Enamel; 1-Part; Liquid; Acetone; Solvent
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Loctite 401
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
Manufacturer: Henkel
Substrate: Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance: Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Solvent; Unleaded gasoline; Water/glycol resistance
300 General Purpose Spray Adhesive
Bond; 1-Part; Aerosol; Hexane; Solvent
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Manufacturer: Camie Campbell
Substrate: Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Chemical Resistance: Good
Package Sizes
Spray
3748
Bond; 1-Part; Sticks; Hot melt; Hot melt
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Manufacturer: 3M
Substrate: Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density)
; Polyolefins; Polypropylene; Polypropylene (High Density)
; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
3762
Bond; 1-Part; Stick; EVA; Hot melt
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
Manufacturer: 3M
Substrate: Coated Cardboard; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Corrugated; Douglas Fir
; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood
Thermogrip 2109
Bond; 1-Part; Stick; Hot melt; Hot melt
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.
Manufacturer: Bostik
Substrate: CardBoard; Paper; Foams; Porous; Wood
Chemical Resistance: Acids; Alkalies; Chemical resistance; Water
3120 RTV Silicone Rubber w/ 1 Catalyst 5:1
Encapsulate; 2-Part; Liquid; Silicone rubber surfaces; Base/Catalyst
Low tear strength, high durometer, excellent heat stability.
Manufacturer: Dow
Substrate: Paper; Aluminum foil; Metal; Plastic; Polyesters
1357
Bond; 1-Part; Liquid; Acetone; Solvent
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.
Manufacturer: 3M
Substrate: Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
3738
Bond; 1-Part; Pellets; Hot melt; Hot melt
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard
Manufacturer: 3M
Substrate: Paper; Uncoated Cardboard; ABS; Canvas; Chipboard; Coated corrugated; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plain corrugated; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood
HM-324
Adhesive; 1-Part; Pellets; EVA; Hot melt
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.
Manufacturer: Elemelt
Substrate: Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
Package Sizes
50 lb Carton
Substrate
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Cardboard; Metal; Wood
Coat; Enamel
1-Part
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Solvent; Unleaded gasoline; Water/glycol resistance
Bond; Instant Adhesives
1-Part
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Good
Bond
1-Part
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density)
; Polyolefins; Polypropylene; Polypropylene (High Density)
; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
Bond
1-Part
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Coated Cardboard; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Corrugated; Douglas Fir
; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood
Bond; Repair; Seal
1-Part
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
CardBoard; Paper; Foams; Porous; Wood
Acids; Alkalies; Chemical resistance; Water
Bond
1-Part
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.
Paper; Aluminum foil; Metal; Plastic; Polyesters
Encapsulate; Mold-Making; Pot
2-Part
Low tear strength, high durometer, excellent heat stability.
Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
Bond
1-Part
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.
Paper; Uncoated Cardboard; ABS; Canvas; Chipboard; Coated corrugated; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plain corrugated; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood
Bond; Seal
1-Part
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard
Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
Adhesive
1-Part
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.
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