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Specialty Materials Compatible with Paper Grid


3762

Bond; 1 Part; Stick; Jet melt; Hot melt;
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood;
Manufacturer: 3M
Substrate: Corrugated; Paper; Beadboard; ChipBoard; Coated Cardboard; Coated Chipboard; Douglas Fir ; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Cardboard; Uncoated Chipboard; Wood

300 General Purpose Spray Adhesive

Bond; 1 Part; Aerosol; Hexane; Solvent;
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer: Camie Campbell
Substrate: Paper; Cardboard; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood

DSP31-401

Bond; 1 Part; Dot; Hot melt; Pressure-Sensitive;
Stiff adhesive with medium peel strength and medium shear strength. Stronger bond, may tear paper.;
Manufacturer: Glue Dots
Substrate: Paper; Aluminum; Ceramic; Copper; Fabric; General; Glass; Metal; Plastic; Polycarbonate; Polyester; Polypropylene; PVC; Rubber; Stainless Steel; Steel; Wood

3738

Bond; 1 Part; Pellets; Hot melt; Hot melt;
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard;
Manufacturer: 3M
Substrate: Paper; Plain and coated corrugated; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Cardboard; Uncoated Chipboard; Wood

3748

Bond; 1 Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer: 3M
Substrate: Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy, Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene, Polyethylene (High Density) ; Polyolefins; Polypropylene, Polypropylene (High Density) ; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard

HM-324

Adhesive; 1 Part; Pellets; EVA; Hot melt;
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.;
Manufacturer: Elemelt
Substrate: Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek

Loctite 401

Bond; 1 Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer: Henkel
Substrate: Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased), Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate

Thermogrip 2109

Bond; 1 Part; Stick; Hot melt; Hot melt;
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.;
Manufacturer: Bostik
Substrate: Paper; CardBoard; Foams; Porous; Wood

1357

Bond; 1 Part; Liquid; Acetone; Solvent;
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.;
Manufacturer: 3M
Substrate: Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood

3120 RTV Silicone Rubber w/ 1 Catalyst 5:1

Encapsulate; 2 Part; Liquid; Silicone rubber surfaces; Base/Catalyst;
Low tear strength, high durometer, excellent heat stability.;
Manufacturer: Dow
Substrate: Paper; Aluminum foil; Metal; Plastic; Polyesters

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Corrugated

;

Paper

;

Beadboard

;

ChipBoard

;

Coated Cardboard

;

Coated Chipboard

;

Douglas Fir

;

Fabric

;

Flexible foam

;

PolyEthylene

;

Polystyrene Foam

;

Polystyrene Foam

;

Uncoated Cardboard

;

Uncoated Chipboard

;

Wood

Bond

;

Repair

;

Seal

1 Part

Stick

Order Sample

Paper

;

Cardboard

;

Fabric

;

Fiberglass

;

Foil

;

Leather

;

Metal

;

Plastic

;

Porous

;

Wood

Bond

1 Part

Aerosol

Order Sample

Paper

;

Aluminum

;

Ceramic

;

Copper

;

Fabric

;

General

;

Glass

;

Metal

;

Plastic

;

Polycarbonate

;

Polyester

;

Polypropylene

;

PVC

;

Rubber

;

Stainless Steel

;

Steel

;

Wood

Bond

1 Part

Dot

Order Sample

Paper

;

Plain and coated corrugated

;

ABS

;

Canvas

;

Chipboard

;

Douglas fir

;

Fabric

;

Flexible Foam

;

Foams

;

FRP

;

Laminate

;

Leather

;

Many plastics

;

Masonite

;

Other lightweight materials

;

Plastic

;

Polycarbonate

;

PolyEthylene

;

Polyolefins

;

Polystyrene Foam

;

Polystyrene Foam

;

Rigid Vinyl

;

Sand cores

;

Uncoated Cardboard

;

Uncoated Chipboard

;

Wood

Bond

;

Seal

1 Part

Pellets

;

Stick

Order Sample

Paper

;

ABS

;

Acrylic

;

Canvas

;

Carbon

;

Ceramic

;

Coated Cardboard

;

Coated Chipboard

;

Copper

;

Corrugated

;

Douglas Fir

;

Epoxy, Epoxy Glass FR-4

;

Fabric

;

Flexible foam

;

FRP

;

Glass

;

Laminate

;

Metal

;

Phenolic

;

Plastics

;

Polycarbonate

;

PolyEthylene, Polyethylene (High Density)

;

Polyolefins

;

Polypropylene, Polypropylene (High Density)

;

Polystyrene Foam

;

Polystyrene Foam

;

Uncoated Card Board

;

Uncoated Chipboard

Bond

1 Part

Sticks

Order Sample

Paper

;

Metal

;

Polycarbonate

;

Polypropylene

;

polystyrene

;

Tyvek

Adhesive

1 Part

Pellets

Order Sample

Paper

;

ABS

;

Absorbent materials

;

Acrylic

;

Aluminum (etched)

;

Buna-N

;

Ceramic

;

Chipboard

;

Difficult-to-bond materials

;

Elastomers

;

Fabric

;

Leather

;

Metals

;

Neoprene

;

Nitrile

;

Nylon

;

Phenolic

;

Plastics

;

Polycarbonate

;

Polyester

;

Porous

;

PVC

;

Rubber

;

Steel (degreased), Steel (grit blasted)

;

Wood

;

Wood (Balsa)

;

Wood (Oak)

;

Zinc Dichromate

Bond

;

Instant Adhesives

1 Part

Liquid

Order Sample

Paper

;

CardBoard

;

Foams

;

Porous

;

Wood

Bond

1 Part

Stick

Order Sample

Paper

;

Paper Honeycomb

;

Birch

;

Cloth

;

Decorative plastic laminates

;

Foamed Glass

;

Foamed Glass

;

Laminates

;

Many other substrates

;

Metal

;

Most rubber

;

Plastic

;

Plastic laminates

;

Wood

Bond

1 Part

Liquid

Order Sample

Paper

;

Aluminum foil

;

Metal

;

Plastic

;

Polyesters

Encapsulate

;

Mold-Making

;

Pot

2 Part

Liquid

Order Sample
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