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Specialty Materials Compatible with Paper Grid
3762
Bond; 1 Part; Stick; EVA; Hot melt;
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood;
Manufacturer:
3M
Substrate:
Corrugated; Paper; Beadboard; ChipBoard; Coated Cardboard; Coated Chipboard; Douglas Fir
; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Uncoated Cardboard; Uncoated Chipboard; Wood
300 General Purpose Spray Adhesive
Bond; 1 Part; Aerosol; Hexane; Solvent;
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer:
Camie Campbell
Substrate:
Paper; Cardboard; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
DSP31-401
Bond; 1 Part; Dot; Hot melt; Pressure-Sensitive;
Stiff adhesive with medium peel strength and medium shear strength. Stronger bond, may tear paper.;
Manufacturer:
Glue Dots
Substrate:
Paper; Aluminum; Ceramic; Copper; Fabric; General; Glass; Metal; Plastic; Polycarbonate; Polyester; Polypropylene; PVC; Rubber; Stainless Steel; Steel; Wood
3738
Bond; 1 Part; Pellets; Jet melt; Hot melt;
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard;
Manufacturer:
3M
Substrate:
Paper; Plain and coated corrugated; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Cardboard; Uncoated Chipboard; Wood
3748
Bond; 1 Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer:
3M
Substrate:
Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy, Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene, Polyethylene (High Density)
; Polyolefins; Polyolefins; Polypropylene, Polypropylene (High Density)
; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
HM-324
Adhesive; 1 Part; Pellets; EVA; Hot melt;
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.;
Manufacturer:
Elemelt
Substrate:
Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
Loctite 401
Bond; 1 Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer:
Henkel
Substrate:
Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased), Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
3120 RTV Silicone Rubber w/ 1 Catalyst 5:1
Encapsulate; 2 Part; Liquid; Silicone rubber surfaces; Base/Catalyst;
Low tear strength, high durometer, excellent heat stability.;
Manufacturer:
Dow
Substrate:
Paper; Aluminum foil; Metal; Plastic; Polyesters
1357
Bond; 1 Part; Liquid; Acetone; Solvent;
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.;
Manufacturer:
3M
Substrate:
Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
Thermogrip 2109
Bond; 1 Part; Stick; Hot melt; Hot melt;
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.;
Manufacturer:
Bostik
Substrate:
Paper; CardBoard; Foams; Porous; Wood
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