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160 Coverall Tan Blockout Enamel
Enamel; 1-Part; Liquid; Acetone; Solvent;
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer:
Camie Campbell
Substrate:
Cardboard; Metal; Wood
3762
Bond; 1-Part; Stick; EVA; Hot melt;
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood;
Manufacturer:
3M
Substrate:
Coated Cardboard; Corrugated; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Douglas Fir
; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood
300 General Purpose Spray Adhesive
Bond; 1-Part; Aerosol; Hexane; Solvent;
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.;
Manufacturer:
Camie Campbell
Substrate:
Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Chemical Resistance:
Good
3738
Bond; 1-Part; Pellets; Hot melt; Hot melt;
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard;
Manufacturer:
3M
Substrate:
Paper; Plain and coated corrugated; Uncoated Cardboard; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood
3748
Bond; 1-Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer:
3M
Substrate:
Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density)
; Polyolefins; Polypropylene; Polypropylene (High Density)
; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
Loctite 401
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer:
Henkel
Substrate:
Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance:
Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance
Thermogrip 2109
Bond; 1-Part; Stick; Hot melt; Hot melt;
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.;
Manufacturer:
Bostik
Substrate:
CardBoard; Paper; Foams; Porous; Wood
Chemical Resistance:
Acids; Alkalies; Chemical resistance; Water
1357
Bond; 1-Part; Liquid; Acetone; Solvent;
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.;
Manufacturer:
3M
Substrate:
Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
HM-324
Adhesive; 1-Part; Pellets; EVA; Hot melt;
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.;
Manufacturer:
Elemelt
Substrate:
Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
3120 RTV Silicone Rubber w/ 1 Catalyst 5:1
Encapsulate; 2-Part; Liquid; Silicone rubber surfaces; Base/Catalyst;
Low tear strength, high durometer, excellent heat stability.;
Manufacturer:
Dow
Substrate:
Paper; Aluminum foil; Metal; Plastic; Polyesters
160 Coverall Tan Blockout Enamel
Enamel; 1-Part; Liquid; Acetone; Solvent
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.
3762
Bond; 1-Part; Stick; EVA; Hot melt
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
Manufacturer: 3M
Substrate: Coated Cardboard; Corrugated; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Douglas Fir
; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood
300 General Purpose Spray Adhesive
Bond; 1-Part; Aerosol; Hexane; Solvent
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Manufacturer: Camie Campbell
Substrate: Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Chemical Resistance: Good
Package Sizes
Spray
3738
Bond; 1-Part; Pellets; Hot melt; Hot melt
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard
Manufacturer: 3M
Substrate: Paper; Plain and coated corrugated; Uncoated Cardboard; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood
3748
Bond; 1-Part; Sticks; Hot melt; Hot melt
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Manufacturer: 3M
Substrate: Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density)
; Polyolefins; Polypropylene; Polypropylene (High Density)
; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
Loctite 401
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
Manufacturer: Henkel
Substrate: Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Chemical Resistance: Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance
Thermogrip 2109
Bond; 1-Part; Stick; Hot melt; Hot melt
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.
Manufacturer: Bostik
Substrate: CardBoard; Paper; Foams; Porous; Wood
Chemical Resistance: Acids; Alkalies; Chemical resistance; Water
1357
Bond; 1-Part; Liquid; Acetone; Solvent
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.
Manufacturer: 3M
Substrate: Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
HM-324
Adhesive; 1-Part; Pellets; EVA; Hot melt
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.
Manufacturer: Elemelt
Substrate: Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
Package Sizes
50 lb Carton
3120 RTV Silicone Rubber w/ 1 Catalyst 5:1
Encapsulate; 2-Part; Liquid; Silicone rubber surfaces; Base/Catalyst
Low tear strength, high durometer, excellent heat stability.
Manufacturer: Dow
Substrate: Paper; Aluminum foil; Metal; Plastic; Polyesters
Substrate
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Cardboard; Metal; Wood
Coat; Enamel
1-Part
An excellent box cover-up that is fast drying, waterproof, and will not rub off, once dry. Prevents bleed through of old labels and stenciling. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Coated Cardboard; Corrugated; Paper; Uncoated Cardboard; Beadboard; ChipBoard; Coated Chipboard; Douglas Fir
; Fabric; Flexible foam; PolyEthylene; Polystyrene Foam; Polystyrene Foam; Uncoated Chipboard; Wood
Bond; Repair; Seal
1-Part
Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood
Cardboard; Paper; Fabric; Fiberglass; Foil; Leather; Metal; Plastic; Porous; Wood
Good
Bond
1-Part
Offers quick adhesion to metal, plastic, wood, paper, cardboard, fabric, leather, etc. It is essentially colorless and produces instant tack with high strength to form a temporary or permanent bond. Good coverage and economical. Does not contain chlorofluorocarbons or ozone depleting chemicals.
Paper; Plain and coated corrugated; Uncoated Cardboard; ABS; Canvas; Chipboard; Douglas fir; Fabric; Flexible Foam; Foams; FRP; Laminate; Leather; Many plastics; Masonite; Other lightweight materials; Plastic; Polycarbonate; PolyEthylene; Polyolefins; Polystyrene Foam; Polystyrene Foam; Rigid Vinyl; Sand cores; Uncoated Chipboard; Wood
Bond; Seal
1-Part
High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard
Coated Cardboard; Paper; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy; Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Phenolic; Plastics; Polycarbonate; PolyEthylene; Polyethylene (High Density)
; Polyolefins; Polypropylene; Polypropylene (High Density)
; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
Bond
1-Part
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins
Paper; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Phenolic; Plastics; Polycarbonate; Polyester; Porous; PVC; Rubber; Steel (degreased); Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
Ethanol; Freon TA; Isopropanol; Isopropyl alcohol; Motor Oil; Solvent; Unleaded gasoline; Water/glycol resistance
Bond; Instant Adhesives
1-Part
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.
CardBoard; Paper; Foams; Porous; Wood
Acids; Alkalies; Chemical resistance; Water
Bond
1-Part
Medium-setting hot melt adhesive, economical with low viscosity and quick grab ability very good "gunability" in stick form.
Paper; Paper Honeycomb; Birch; Cloth; Decorative plastic laminates; Foamed Glass; Foamed Glass; Laminates; Many other substrates; Metal; Most rubber; Plastic; Plastic laminates; Wood
Bond
1-Part
• Neoprene High Performance Contact Adhesive • Long bonding range • Excellent initial strength • High heat resistance.
Paper; Metal; Polycarbonate; Polypropylene; polystyrene; Tyvek
Adhesive
1-Part
This EVA hot melt was designed as a permanent adhesive for bond of flexible polyolefin films. Good adhesion to paper, metal and some plastics.
Paper; Aluminum foil; Metal; Plastic; Polyesters
Encapsulate; Mold-Making; Pot
2-Part
Low tear strength, high durometer, excellent heat stability.
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