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Specialty Materials Compatible with Polycarbonate Grid
UR3010
Encapsulate; 2 Part; Liquid; TDI; Heat;
A two component, room temperature curing polyurethane potting system. It is designed to cure completely at room temperature.
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Manufacturer:
Resinlab
Substrate:
Polycarbonate; Ceramic; Aluminum; Metals; Plastic; Polyester; Polyvinyl chloride (PVC); Steel
406 w/ Accelerator 19
Bond; 2 Part; Paste; Acrylic; 2-Part Cure;
Used to replace welding, brazing, riveting and other mechanical fastening methods.;
Manufacturer:
Parker Lord
Substrate:
Polycarbonate; A wide variety of prepared metals; A wide variety of unprepared metals; ABS; Acrylic; Aluminum; Engineered thermoplastics; Galvanized steel; Galvanized steel; Powder coated steel; Xenoy
Dowsil 832 Multi-Surface Adhesive Sealant
Sealing; 1 Part; Paste; Silicone; Moisture;
One-part, RTV silicone sealant, low odor, neutral cure, will not corrode substrates, superior unprimed adhesion, cures to a tough rubbery solid.;
Manufacturer:
Dow
Substrate:
Polycarbonate (primed), Polycarbonate (unprimed); A wide variety of surfaces; ABS; Acrylic (primed); Aluminum, anodized, Aluminum, milled; Brass; Carbon, Steel, Steel, millled; Concrete; Glass; Masonry; Metals; Most rubber; Neoprene; Phenolic (G-10); Plastics; Polystyrene; PVC; Silicone rubber; Stainless steel; Steel, galvanized; Steel, galvanized; Wrought Iron
HP 250
Bond; 2 Part; Liquid; Epoxy; Resin/Hardener;
High performance epoxy with high shear strength, impact toughness for structural assembly applications.;
Manufacturer:
Devcon (ITW)
Substrate:
PC; AL; Aluminum; FRP composites; Galvanized metals; Galvanized metals; GBS; Metals; Nylon; Phenolics; PVC; Rigid plastics; SMC composites; Stainless Steel; Styrenics; Vinyl esters; Wood
Loctite 401
Bond; 1 Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Manufacturer:
Henkel
Substrate:
Polycarbonate; ABS; Absorbent materials; Acrylic; Aluminum (etched); Buna-N; Ceramic; Chipboard; Difficult-to-bond materials; Elastomers; Fabric; Leather; Metals; Neoprene; Nitrile; Nylon; Paper; Phenolic; Plastics; Polyester; Porous; PVC; Rubber; Steel (degreased), Steel (grit blasted); Wood; Wood (Balsa); Wood (Oak); Zinc Dichromate
DSP31-401
Bond; 1 Part; Dot; Hot melt; Pressure-Sensitive;
Stiff adhesive with medium peel strength and medium shear strength. Stronger bond, may tear paper.;
Manufacturer:
Glue Dots
Substrate:
Polycarbonate; Aluminum; Ceramic; Copper; Fabric; General; Glass; Metal; Paper; Plastic; Polyester; Polypropylene; PVC; Rubber; Stainless Steel; Steel; Wood
UR1049
Bond; 2 Part; Polyurethane Foam; Urethane; Part A/Part B;
A two component, Cream, water blown, 4 lb per cubic foot, MDI based rigid polyurethane foam system. It is designed to cure completely at room temperature. It provides excellent environmental protection and thermal insulation properties.;
Manufacturer:
Resinlab
Substrate:
Polycarbonate; Ceramic; Aluminum; Metals; Plastic; Polyester; Polyvinyl chloride (PVC); Steel
16
Bond; 1 Part; Liquid; Acrylic; Solvent;
Fast-setting, medium bodied, high strength acrylic cement. Also bonds rigid PVC, ABS, styrene, butyrate, polycarbonate to themselves and each other, as well as other plastics and porous surfaces.;
Manufacturer:
SCIGRIP (Weld-On)
Substrate:
Polycarbonate; ABS; Acrylic, Acrylic plastic; Butyrate; Polystyrene; Porous; PVC; Styrene
EP11HT
Bond; 2 Part; Thixotropic paste; Epoxy; Part A/Part B;
A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.;
Manufacturer:
Resinlab
Substrate:
Polycarbonate; Ceramic; Aluminum, 2024 T3 Aluminum Abraded/Mek wipe; Copper; Fabric; Glass; Metal; Neoprene; Nylon; Other various substrates; Plastic; Polyester; Polyvinyl chloride (PVC); Rubber; Steel; Stone; Wood
3748
Bond; 1 Part; Sticks; Hot melt; Hot melt;
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins;
Manufacturer:
3M
Substrate:
Polycarbonate; ABS; Acrylic; Canvas; Carbon; Ceramic; Coated Cardboard; Coated Chipboard; Copper; Corrugated; Douglas Fir; Epoxy, Epoxy Glass FR-4; Fabric; Flexible foam; FRP; Glass; Laminate; Metal; Paper; Phenolic; Plastics; PolyEthylene, Polyethylene (High Density)
; Polyolefins; Polypropylene, Polypropylene (High Density)
; Polystyrene Foam; Polystyrene Foam; Uncoated Card Board; Uncoated Chipboard
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