3M 4936

Surface Preparation

Most substrates are best prepared by cleaning with a 50:50 mixture of isopropyl alcohol (IPA*) and water prior to applying 3M™ VHB™ Tapes.

See Vendor Technical Data Sheet for more info.

To obtain good performance with all 3M™ VHB™ Tapes, it is important to ensure that the surfaces are dry and free of condensed moisture.

Application

Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure develops better adhesive contact and helps improve bond strength. Typically, good surface contact can be attained by applying enough pressure to insure that the tape experiences approximately 15 psi (100 kPa) pressure. Either roller or platen pressure can be used. Note that rigid surfaces may require 2 or 3 times that much pressure to make the tape experience 15 psi.

Ideal application temperature range is 70°F to 100°F (21°C to 38°C). Pressure sensitive adhesives use viscous flow to achieve substrate contact area. Minimum suggested application temperatures:60°F (15°C): 3M™ VHB™ Tapes 4941, 4945 families.

Note: Initial tape application to surfaces at temperatures below these suggested minimums is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

Curing

After application, the bond strength will increase as the adhesive flows onto the surface (also referred to as “wet out”). At room temperature approximately 50% of ultimate bond strength will be achieved after 20 minutes, 90% after 24 hours and 100% after 72 hours. This flow is faster at higher temperatures and slower at lower temperatures. Ultimate bond strength can be achieved more quickly (and in some cases bond strength can be increased) by exposure of the bond to elevated temperatures (e.g. 150°F [66°C] for 1 hour). This can provide better adhesive wetout onto the substrates. Abrasion of the surfaces or the use of primers/ adhesion promoters can also have the effect of increasing bond strength and achieving ultimate bond strength more quickly.