Appli-Tec 5018 Epoxy Datasheet Appli-Tec 5018 Epoxy

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  • Description for Appli-Tec 5018 Epoxy

    Appli-Tec 5018 Epoxy is a 1-Part Heat Epoxy Liquid used to Adhere Ceramics, Most substrates and Glass

    *See Terms of Use Below

    Application Type Bonding
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Ceramics, Glass, Metals, Most plastics , Dissimilar substrates
    Manufacturer Appli-Tec
    Chemistry Epoxy, Toughened
    Cure Method Heat, Room temperature
    Cure Temperature (°C) 25, 45, 80
    Cure Time (min) 10,080, 4,320, 360
    Viscosity (cPs) Low, 3,500
    Color Amber
    High Temperature Resistance (°C) >240, Thermal shock resistant
    Low Temperature Resistance (°C) Excellent low temperature properties
    Volume Resistivity (O) 1.0E 14 (ohm-cm)
    Density (g/cm³) 1.13 (g/cc)
    Key Specifications ISO 9001 certified

  • Technical Data for Appli-Tec 5018 Epoxy

    *See Terms of Use Below

    Overview
    • Application Type
      • Adhesive
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
      • Ceramic
      • Glass
      • Dissimilar Substrates
      • Metal
      • Plastic
      • Other
    • Industry
    • Chemistry
      • Toughened
      • Epoxy
    • Cure Method
      • Room Temperature / Air Dry
      • Heat
    • Color
      • Amber
    • Key Specifications
      • International Organization for Standardization
    Specifications
    Cure Specs
    Cure Temperature (°C) Register to view
    Cure Time (min)
    Viscosity (cPs)
    Work / Pot Time (min)
    Bond Strength
    General Bond Strength (psi) Register to view
    Material Resistance
    High Temperature Resistance (°C) Register to view
    Low Temperature Resistance (°C)
    Conductivity
    Dielectric Strength (V/mil) Register to view
    Volume Resistivity (O)
    Hardness
    Shore D Hardness Register to view
    Flexibility
    Other Properties
    Glass Transition Temp (Tg) (°C) Register to view
    Outgassing
    Density (g/cm³)
    Business Information
    Shelf Life Temperature (°F) Register to view
    Shelf Life (mon)

  • Best Practices

    Best Practices information currently not available.

  • Comparable Materials for Appli-Tec 5018 Epoxy

    *See Terms of Use Below

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    • MicroCoat Technologies
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      A single component, toughened, microelectronic grade package sealant with a service temperature of <-55 oC to over >300°C and meets NASA low outgassing specifications.

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Viscosity Test Methods
Viscosity Test Method Temperature
Low
3,500 cPs Uncured 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long work life
360 min Uncured, work life 25°C
180 min Uncured, pot life 25°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
>240°C Degradation temp., Based on cure of 6 hours @ 80°C, cured
Thermal shock resistant
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.0E 14 (ohm-cm) Based on cure of 6 hours @ 80°C, @ 500 VDC, cured
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
80 Based on cure of 6 hours @ 80°C, cured
Density Test Methods
Density Test Method
1.13 (g/cc) Based on cure of 6 hours @ 80°C, cured
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
60°C Based on cure of 6 hours @ 80°C, cured
Outgassing Test Methods
Outgassing Test Method
Low
0.18 (%) CVCM
0.75 (%) TML