Dow Dowsil Q3-1566 Heat Resistant Adhesive/ Sealant Datasheet Dow Dowsil Q3-1566 Heat Resistant Adhesive/ Sealant

Information provided by Gluespec
  • Description for Dow Dowsil Q3-1566 Heat Resistant Adhesive/ Sealant

    • One-component adhesive/sealant • Cures at room temperature when exposed to moisture in the air • Acetoxy cure system • Non-sag, paste consistency • Good adhesion on many substrates.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Bond, Sealant
    1 Part or 2 Part 1-Part
    Material Form Paste
    Industry Power Tools, Automotive oil, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Room Temperature Cure, Moisture, Acetoxy cure
    Cure Temperature (°C) 20 to 25 Room temperature, 23
    Cure Time (min) 1,440, 10,080
    Viscosity (cPs) Non-sag
    Color Black
    High Temperature Resistance (°C) Heat Resistant, High temperature resistant
    Crack Resistance No cracks
    Extrusion Rate (g/sec) 16,200 270 (g/minute)
  • Technical Data for Dow Dowsil Q3-1566 Heat Resistant Adhesive/ Sealant

    Overview
    • Application Type
      • Adhesive - Bond
      • Sealant
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Paste
    • Substrate
      • Other - Many substrates
    • Industry
      • Smart Home Devices
      • Automotive - Automotive oil
      • Industrial - Ovens, Cookers, Other heating equipment
      • Power Tools
      • Appliances - Ceramic hob
      • Other - Other coolant sealing applications
    • Chemistry
      • Silicone
    • Application Method
      • Brush - Brushing
      • Spray - Spraying
      • Dip - Dipping
    • Cure Method
      • Room Temperature / Air Dry - Room Temperature Cure
      • Moisture / Condensation Cure - Moisture
      • Other - Acetoxy cure
    • Color
      • Black
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room temperature, 23 Test Method
    Cure Time (min) 1,440, 10,080 Test Method
    Viscosity (cPs) Non-sag
    Tack Free Time (min) 5.00 Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Tensile Strength (psi) 3.6 (MPa) Test Method
    Material Resistance
    High Temperature Resistance (°C) Heat Resistant, High temperature resistant
    Hardness
    Crack Resistance No cracks
    Shore A Hardness 43 Test Method
    Elongation (%) 340 Test Method
    Flexibility Remain flexible
    Other Properties
    Extrusion Rate (g/sec) 16,200 270 (g/minute)
    Specific Gravity 1.060 Test Method
    Business Information
    Shelf Life Details Product should be stored at or below 32°C (90°F) in original, unopened containers.
    Shelf Life Temperature (°F) <90
  • Best Practices for Dow Dowsil Q3-1566 Heat Resistant Adhesive/ Sealant

    *See Terms of Use Below

    1. Application

      Easy to apply

      How to apply: Apply a bead of DOWSIL™ Q3- 1566 Heat Resistant Adhesive/ Sealant (see Handling Precautions) to one of the prepared surfaces, then quickly cover with the other substrate to be bonded.

      On exposure to moisture, the freshly applied material will "skinover" in about 5–7 minutes at room temperature and 50% relative humidity. Any tooling should be completed before this skin forms. The surface is easily tooled with a spatula. The sealant will be tackfree in about 18 minutes.

    2. Surface Preparation

      All surfaces must be clean and dry. Degrease and wash off any contaminants that could impair adhesion. Suitable solvents include isopropyl alcohol, acetone or methyl ethyl ketone.

      Unprimed adhesion may be obtained on many substrates such as glass, metals and most common engineering plastics. Substrates to which good adhesion is normally not obtained include PTFE, polyethylene, polypropylene and related materials.

      For maximum adhesion, the use of DOWSIL™ 1200 OS Primer is recommended. After solvent cleaning, a thin coat of DOWSIL 1200 OS Primer is applied by dipping, brushing or spraying. Allow primer to dry for 15 to 90 minutes at room temperature and in a relative humidity of 50% or higher.

    3. Curing

      After skin formation, cure continues inward from the surface. In 24 hours (at room temperature and 50% relative humidity) DOWSIL Q3-1566 Heat Resistant Adhesive/ Sealant will cure to a depth of about 3 mm. Very deep sections, especially when access to atmospheric moisture is restricted, will take longer to cure completely. Cure time is extended at lower humidity levels.

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    *See Terms of Use Below

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Gluespec Poll

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Tack Free Time Test Methods
Tack Free Time Test Method
5.00 min CTM 0098, Skin-over-time
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room temperature 50% relative humidity
23°C 50% relative humidity
Cure Time Test Methods
Cure Time Test Method
1,440 min 50% relative humidity
10,080 min 50% relative humidity
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Test Method
3.6 (MPa) 10,080 min 23°C CTM 0137A, ASTM D412, 50% relative humidity
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
43 CTM 0099, ASTM D2240, Durometer, Mechanical properties, cured 7 days in air at 23°C (73°F) and 50% relative humidity
Elongation Test Methods
Elongation Test Method
340 % At break, CTM 0137A, ASTM D412, Cured 7 days in air at 23°C (73°F) and 50% relative humidity
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.060 25°C CTM 0022, ASTM D792, Cured 7 days in air at 23°C (73°F) and 50% relative humidity