Star Technology 811-01 Datasheet Star Technology 811-01

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  • Description for Star Technology 811-01

    Star Technology 811-01 is a 2-Part 2-Part Cure Epoxy Liquid used to Adhere Aluminum, Copper and Fabrics

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Aluminum, Copper, Fabrics, Most structural plastics, Steel, Stainless steel, Brass
    Industry General purpose
    Manufacturer Star Technology
    Chemistry Epoxy
    Cure Method 2-Part Cure, Room temperature
    Cure Temperature (°C) 24, 24
    Cure Time (min) 1,440, 10,080
    Viscosity (cPs) 12,000
    Color Clear
    High Temperature Resistance (°C) Thermal shock, <82
    Density (g/cm³) 59 (lbs./cu.ft.)
    Can Be Used In Conjunction With These Materials Epoxy powder coatings

  • Technical Data for Star Technology 811-01

    *See Terms of Use Below

    Overview
    • Application Type
      • Adhesive
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
      • Aluminum
      • Copper
      • Steel
      • Brass
      • Plastic
      • Fabric
      • Stainless Steel
      • Other
    • Industry
      • General Purpose
    • Chemistry
      • Epoxy
    • Cure Method
      • Room Temperature / Air Dry
      • 2-Part Cure
    • Color
      • Clear / Transparent
    • Can Be Used In Conjunction With These Materials
      • Epoxies
    Specifications
    Cure Specs
    Cure Temperature (°C) Register to view
    Cure Time (min)
    Viscosity (cPs)
    Set Time (min)
    Linear Shrinkage (%)
    Work / Pot Time (min)
    Mix Ratio
    Bond Strength
    General Bond Strength (psi) Register to view
    Shear Strength (psi)
    Flexural Strength (psi)
    Tensile Strength (psi)
    Material Resistance
    High Temperature Resistance (°C) Register to view
    Impact Resistance
    Hardness
    Shore D Hardness Register to view
    Modulus (psi)
    Other Properties
    Coefficient of Thermal Expansion (CTE) Register to view
    Density (g/cm³)

  • Best Practices for Star Technology 811-01

    *See Terms of Use Below

    1. Surface Preparation

      For best results, the substrates should be cleaned and free of any grease, oils or foreign materials. When possible metallic substrates should be etched, or sand blasted to increase adhesion. FRP and pultrusion substrates should be sanded to expose the glass or carbon reinforcement and remove any release agents.

    2. Application

      Pour the mixed material in the thinnest stream possible into a single spot of the mold cavity or in the sprue holes as desired. Allow the mixture to flow slowly over the mold surface or into the sprue hole to help eliminate air entrapment.

    3. Mixing

      Carefully weigh out appropriate amounts of resin and hardener into a clean mixing container and thoroughly mix until all streaks and striations are gone. Scrape the sides and bottom frequently to ensure complete mixing.

      CAUTION: Unmixed compound from the sides or bottom of the container can cause soft spots or uncured areas in the completed casting. To prevent this, transfer the entire mixed contents to a second clean container and remix for a short time before using.

  • Comparable Materials for Star Technology 811-01

    *See Terms of Use Below

    Spec Engine® Results

    • HB Fuller
      48173/58173(HB Fuller)

      An extra fast setting, two–component, room temperature curing epoxy adhesive. The system will cure at as low as –18 °C (0 °F). It has a convenient mix ratio, excellent cohesive strength and bonds to most substrates including metal, wood, concrete, ceramics and many plastics.

    • GS Polymer
      SM 2004(GS Polymer)

      A silicone–modified epoxy potting compound. The system offers exceptional adhesion to metal and bonds to most substrates without need for primer.

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Linear Shrinkage Test Methods
Linear Shrinkage Test Method
0.11 % Cured 7 days at 75°F
Viscosity Test Methods
Viscosity Test Method
12,000 cPs Mixed, ASTM D2393, Cured 7 days
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
3.00 to 5.00 min 100 Grams, ASTM D2471, Cured 7 days 24°C
5.00 to 7 min Thin Film, ASTM D2471, Cured 7 days 24°C
Flexural Strength Test Methods
Flexural Strength Cure Time Cure Temperature Test Method
6,100 psi 10,080 min 24°C Cured
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Test Method
2,800 psi 10,080 min 24°C Cured
Shear Strength Test Methods
Shear Strength Cure Time Cure Temperature Substrate Test Method
3,500 psi 10,080 min 24°C Aluminum/Aluminum Cured
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Thermal shock
<82°C Service temperature, Cured 7 days at 75°F
Modulus Test Methods
Modulus Temperature Test Method
200,000 psi 24°C Flexural Modulus, Cured 7 days
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
80 Cured 7 days at 75°F, ASTM D2240
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Time CTE Test Method
8.6E-5 (in/in/’C) 24°C 10,080 min Cured
Density Test Methods
Density Temperature Time Test Method
59 (lbs./cu.ft.) 24°C 10,080 min Cured, ASTM D1475