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Description for EMD Group (Versum, Dynaloy) J046-02 (Uresolve Blue)
Uresolve Blue is used for fast removal of urethanes utilized in the electronics industry. Uresolve 411 is a stronger version but it has the ability to attack vinyl insulation.Brand Dynaloy Application Type Conformal Coating Remover, Decapsulation, Depotting 1 Part or 2 Part 1-Part Material Form Liquid Substrate Aluminum, Ceramic, Copper, Beryllium and beryllium alloys, Carbon steel, Stainless Steel, Nickel, Bronze, brass, Gold plate, Chromium, Aluminum alloys, Metal, Electroless nickel plate Industry Electronic modules, Printed circuit boards, Aircraft electrical connectors, Cable assemblies, Aircraft electrical connectors, Electronics Manufacturer EMD Group (Versum, Dynaloy) Chemistry Solvent-based Cure Method Solvent Color Blue Key Specifications Mil-Spec (United States Military Standard): R83213-A: Meet the requirements of MIL R83213A, Type 1. Can Be Used In Conjunction With These Materials Urethanes -
Technical Data for EMD Group (Versum, Dynaloy) J046-02 (Uresolve Blue)
Overview
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Application Type
- Cleaner/Debonder/Remover – For Cured Materials
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Substrate
- Ceramic
- Metal
- Aluminum
- Copper
- Steel
- Nickel
- Bronze
- Brass
- Gold
- Chromium
- Stainless Steel
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Industry
- Aircraft
- Electronics
- Printed Circuit Board (PCB)
- Connectors
- Cable
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Chemistry
- Solvent-Based
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Application Method
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Cure Method
- Solvent
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Color
- Blue
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Key Specifications
- Mil-Spec (United States Military Standard) : R83213-A : Type 1
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Can Be Used In Conjunction With These Materials
- Urethanes
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Brand
- Dynaloy
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Best Practices for EMD Group (Versum, Dynaloy) J046-02 (Uresolve Blue)
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Removal
For complete depotting: Immerse component in solvent until all urethane or sealant has dissolved. Time for removal varies with the type and amount of material being removed.
It has been found that the critical area in repairing cable assemblies and aircraft connectors is in restoring the electrical properties of the assembly. During the depotting operation, by-products formed have a tendency to be electrically conductive and therefore must be completely removed prior to repotting. These complex organic salts are most readily removed by washing in IPA. The wash cycle should consist of at least two rinses in IPA. The connectors or cable assemblies should not be allowed to dry after the depotting cycle since the residues and film become more difficult to remove. Should assembly dry prior to immersion in the IPA, it is recommended that it be returned to Uresolve Blue or 411, followed by immediate washing in IPA.
For removal of conformal coatings: Immerse the board in solution and cover the container to limit evaporation of the solvent. Thin coatings will require longer soaking. After coating is dissolved, wash in IPA. If a milky residue remains, dissolving action is not complete and the board should be immersed in the solution again.
For partial or spot removal, apply with brush or cotton pad. Both products are also available in a gel form for this application.
For removal of coatings for ceramic or metal substrates where heat can be tolerated and faster action is necessary, we recommend Uresolve Plus SG, and Dynasolve 750 & 711.
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