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93 Results for thixotropic
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Materials Showing 5 results out of 76Showing 10 results out of 76

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Dowsil EG-3000 Thixotropic Gel

Seal; 2-Part; Gel; Silicone; Heat cure
• Two part • Translucent • 1:1 mix ratio • thixotropic gel • Heat cure gel
Manufacturer: Dow
Thixotropic: Thixotropic
Shelf Life Details: Storage conditions and shelf life (“Use By” date) are indicated on the product label.
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Silastic 3-8186 Thixotropic Foam

Seal; 2-Part; Foam; Silicone; 2-Part Cure
It is designed to form dispensed in place compression gaskets in applications that require low sealing force. Uses include sealing automotive components and lighting.
Manufacturer: Dow
Thixotropic: Thixotropic
Shelf Life Details: When stored at or below 32°C (90°F), SILASTIC 3-8186 Thixotropic Foam has a shelf life of 8 months from the date of manufacture.
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Dowsil 3-6265 Thixotropic Adhesive

Bond; 1-Part; Liquid; Silicone; Heat
One-part, black, non-flowing adhesive with high tensile strength, and UV indicator for inspection
Manufacturer: Dow
Thixotropic: Thixotropic
Shelf Life Details: Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label.; Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.

Package Sizes

75 g 305 ml 592 ml 18.1 kg
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Loctite HF 212

Soldering; 1-Part; Paste; Pb-free; Solder
A halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste. Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC.
Manufacturer: Henkel
Thixotropic: 0.5, Malcom Thixotropic Index , Based on T3 powder, Solder Paste; 0.5, Malcom Thixotropic Index, Based on T4 powder, Solder Paste; 0.5, Malcom Thixotropic Index, Based on Type 4.5 powder, Solder Paste; 0.5, Thixotropic Index, Based on Type 5 powder, Solder Paste
Shelf Life Details: 183 days, stored in original containers @ 0 to 10°C.
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Sylgard 535 Thixotropic Dielectric Gel

Seal; 1-Part; Gel; Silicone; Heat cure
A 1-part, translucent, thixotropic gel, heat cure, resistance to some solvents and fuels, controlled volatility gels for sensitive applications, and UV curing.
Manufacturer: Dow
Thixotropic: Thixotropic
Shelf Life Details: Storage conditions and shelf life (“Use By” date) are indicated on the product label.
Chemical Resistance: Resistance to fuels; Resistance to some solvents
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Loctite GC 10

Pb-free solder paste; 1-Part; Solder Paste; Pb-free; Solder
A halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions.
Manufacturer: Henkel
Thixotropic: 0.48,Malcom Thixotropic Index, Base on T5 Powder; 0.5, Malcom Thixotropic Index, Based on T4 powder; 0.52, Malcom Thixotropic Index, Based on T3 powder
Shelf Life Details: Provided that LOCTITE GC 10 is stored in the original container, a minimum shelf life of 365 days at 5 to 25°C or 31 days at 40°C can be expected.;Air shipment is recommended to minimise the time the containers are exposed to higher temperatures.; Provided that LOCTITE GC 10 is stored in the original container, a minimum shelf life of 365 days at 5 to 25°C or 31 days at 40°C can be expected.;Air shipment is recommended to minimise the time the containers are exposed to higher temperatures.
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EccoBond 285

Bond; 2-Part; Thixotropic Paste; Epoxy; 2 Parts
Highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive. Low coefficient of thermal expansion and good bond strength.
Manufacturer: Henkel
Thixotropic: Thixotropic
Shelf Life Details: The shelf life of ECCOBOND 285 is 12 months at 25°C. For best results, store in original, tightly covered containers. Storage in cool, clean and dry areas is recommended. Usable shelf life may vary depending on method of application and storage conditions.;Certain resins and hardeners are prone to crystallization. If crystallization does occur, warm the contents of the shipping container to 50-60°C until all crystals have dissolved. Be sure the shipping container is loosely covered during the warming stage to prevent any pressure build-up. Allow contents to cool to room temperature before continuing.
Chemical Resistance: Good

Package Sizes

Black 2 lb Black 18 lb Black 60 lb
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PX628FF

Bonding; 2-Part; Liquid; Epoxy; Room Temperature Cure
• Two-part • Room temperature curing adhesive • Bonding of dissimilar materials, particularly metals to plastics • High adhesion • Thixotropic • High impact resistance • Flexible.
Manufacturer: Resinlab
Thixotropic: 5-15 (mm); Semi Thixotropic; Thixotropic
Shelf Life Details: 24 months at 25 °C Specialty packaging may be less.; Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50 °C) aggravate this phenomenon. Heating the individual component to 50 to 60 °C while stirring can usually restore products to original state. Storage at 25 +/- 10 °C is optimum for most products; Some epoxy systems are prone to settling due to high filler content and should be inverted every two to three weeks to reduce the accumulation of the fillers on the bottom of the containers.; Inventory should be rotated on a FIFO (first in, first out) basis.
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Epo-Tek OJ2933-LH

Bond; 2-Part; Paste; Low halogen; Snap curable
A two component, Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND.
Manufacturer: Epoxy Technology
Thixotropic: 3.0, Thixotropic Index; Thixotropic
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HM118

Threadlock; 1-Part; Liquid; Methacrylate Esters; Anaerobic
General-purpose threadlocker and sealant, cure is fast and reliable on steel, cadmium, zinc and other plated fasteners.
Manufacturer: PermaBond
Thixotropic: Thixotropic
Chemical Resistance: Butyl alcohol; Ethylene glycol; Excellent; Hydrocarbon test fluid; JP4-jet fuel; JP5-jet fuel; Toluene; Water Resistance

Package Sizes

Liter Bottle 250 ml Bottle 50 ml Bottle
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Advanced Search - Grid Showing 10 results out of 76

Manufacturer | Material
Thixotropic Shelf Life Details Chemical Resistance Application Type 1 Part or 2 Part Material Form
Dowsil EG-3000 Thixotropic Gel

Thixotropic

Storage conditions and shelf life (“Use By” date) are indicated on the product label.

Seal

2-Part

Gel

Silastic 3-8186 Thixotropic Foam

Thixotropic

When stored at or below 32°C (90°F), SILASTIC 3-8186 Thixotropic Foam has a shelf life of 8 months from the date of manufacture.

Seal

2-Part

Foam

Dowsil 3-6265 Thixotropic Adhesive

Thixotropic

Refer to product label for storage temperature conditions. Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its Use Before date as indicated on the product label.

,

Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning RTV adhesives should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.

Attaching base plates gasket

,

Bond

,

Seal

1-Part

Liquid

Loctite HF 212

0.5, Malcom Thixotropic Index , Based on T3 powder, Solder Paste

,

0.5, Malcom Thixotropic Index, Based on T4 powder, Solder Paste

,

0.5, Malcom Thixotropic Index, Based on Type 4.5 powder, Solder Paste

,

0.5, Thixotropic Index, Based on Type 5 powder, Solder Paste

183 days, stored in original containers @ 0 to 10°C.

Soldering

1-Part

Paste

Sylgard 535 Thixotropic Dielectric Gel

Thixotropic

Storage conditions and shelf life (“Use By” date) are indicated on the product label.

Resistance to fuels

,

Resistance to some solvents

Seal

1-Part

Gel

Loctite GC 10

0.48,Malcom Thixotropic Index, Base on T5 Powder

,

0.5, Malcom Thixotropic Index, Based on T4 powder

,

0.52, Malcom Thixotropic Index, Based on T3 powder

Provided that LOCTITE GC 10 is stored in the original container, a minimum shelf life of 365 days at 5 to 25°C or 31 days at 40°C can be expected.;Air shipment is recommended to minimise the time the containers are exposed to higher temperatures.

,

Provided that LOCTITE GC 10 is stored in the original container, a minimum shelf life of 365 days at 5 to 25°C or 31 days at 40°C can be expected.;Air shipment is recommended to minimise the time the containers are exposed to higher temperatures.

Pb-free solder paste

1-Part

Solder Paste

EccoBond 285

Thixotropic

The shelf life of ECCOBOND 285 is 12 months at 25°C. For best results, store in original, tightly covered containers. Storage in cool, clean and dry areas is recommended. Usable shelf life may vary depending on method of application and storage conditions.;Certain resins and hardeners are prone to crystallization. If crystallization does occur, warm the contents of the shipping container to 50-60°C until all crystals have dissolved. Be sure the shipping container is loosely covered during the warming stage to prevent any pressure build-up. Allow contents to cool to room temperature before continuing.

Good

Bond

2-Part

Thixotropic Paste

PX628FF

5-15 (mm)

,

Semi Thixotropic

,

Thixotropic

24 months at 25 °C Specialty packaging may be less.; Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50 °C) aggravate this phenomenon. Heating the individual component to 50 to 60 °C while stirring can usually restore products to original state. Storage at 25 +/- 10 °C is optimum for most products; Some epoxy systems are prone to settling due to high filler content and should be inverted every two to three weeks to reduce the accumulation of the fillers on the bottom of the containers.; Inventory should be rotated on a FIFO (first in, first out) basis.

Bonding

2-Part

Liquid

Epo-Tek OJ2933-LH

3.0, Thixotropic Index

,

Thixotropic

Bond

2-Part

Paste

HM118

Thixotropic

Butyl alcohol

,

Ethylene glycol

,

Excellent

,

Hydrocarbon test fluid

,

JP4-jet fuel

,

JP5-jet fuel

,

Toluene

,

Water Resistance

Seal

,

Threadlock

1-Part

Liquid

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Articles 5 Results

Fireproofing EV Batteries

Typically, the gap fillers for EV batteries are applied through pumping. Because these TIMs are highly abrasive, however, they can cause dispensing equipment to wear prematurely. Their low viscosity can also result in uneven distribution across non-planar surfaces. Today, gap-filling solutions include two-part thixotropic fluids where silicone is mixed with special thermally-conductive ceramics. Because these fluids are thixotropic, they improve coverage and can have higher adhesive bond-line thickness.

Read More...

Glob Top Encapsulation

Glob tops are usually epoxies that are dispensed to cover a single chip in chip-on- board (COB) applications. They are most frequently used to encapsulate wire-bonded dies, since the wires bonds often need physical strengthening provided by epoxy, and other methods like conformal coatings or underfilling don't provide the same protection. Glob-top epoxies are thixotropic, meaning their viscosity is variable - becoming less viscous under physical agitation and more viscous under static conditions. They provide "controlled flow" - self-leveling without running over the applied area.

Read More...

Energy Storage and Power Adhesives Guide

Gluespec's Energy Storage and Power Adhesives Guide explains what design engineers need to know about selecting adhesives for battery systems (battery cells, modules, and packs), power supplies, and solar energy and wind energy applications.

Read More...

Static Mixers for Adhesive Dispensing

Static mixers (static mixing nozzles, mix tips) are used with adhesive cartridge systems or meter mix dispensing systems. This article explains how to select them and describes attachment configurations for disposable static mixers.

Read More...

Semiconductor Packaging Adhesives Q&A

There are solutions to these issues, however. To avoid sagging, slumping, and edge roll-up or overflow, design engineers can choose thixotropic pastes that flow easily due to the shear forces developed during dispensing but then stay in place once they are dispensed. Resin bleed-out, an issue that tends to occur on high-energy surfaces, can be addressed by using pastes with anti-bleeding agents. Some of these additives form a thin layer with a surface energy that is lower than the substrate. Others enhance the cohesiveness of the paste itself. For bond lines with a more uniform thickness, there are adhesives with self-leveling properties.

Read More...

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